Nlight, Incorporated

Coherent, Inc.

Wolfram Urbanek

David Martin Hemenway

David C Dawson

Dahv A V Kliner

Roger L Farrow

Aaron W Brown

Michele Wayne Winz

Shelly Lin

Kevin Shea

Kylan Hoener

Jim Schloss

Sam Mallicoat

Guang Li

Larry Potter

Dahv AV Kliner

Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.

Low cost optical pump laser package

A cross-cylinder objective assembly includes a fast axis objective (FAO) situated along an optical axis for focusing an incident laser beam along a fast axis, a slow axis objective (SAO) situated along the optical axis for focusing the incident laser beam along a slow axis, and a lens cell having fast and slow axis objective receiving portions for registering the FAO and SAO at a predetermined spacing along the optical axis.

Passively aligned crossed-cylinder objective assembly

A laser diode assembly, comprising a plurality of laser diodes each configured to emit respective ones of a plurality of laser beams along parallel and nonoverlapping optical axes and a first beam offset plate (BOP) configured to receive a first of the laser beams on a first input surface, the first laser beam having a first input optical axis, the first BOP configured to transmit a first output laser beam that has a first vertical offset from the first input optical axis.

Beam offset plate for optically offsetting one or more laser beams

Beam compressors include separated surfaces having positive and negative optical powers. A surface spacing is selected so that a collimated beam input to the beam compressor is output as a collimated beam. In some examples, beam compressors are situated to compress a laser beam stack that includes beams associated with a plurality of laser diodes. Beam compression ratios are typically selected so that a compressed beam stack focused into an optical waveguide has a numerical aperture corresponding to the numerical aperture of the optical waveguide.

Passively aligned single element telescope for improved package brightness

A method of spectrally multiplexing diode pump modules to increase brightness includes generating one or more pump beams from respective diode lasers at a first wavelength in a diode laser package, generating one or more pump beams from respective diode lasers at a second wavelength different from the first wavelength in the diode laser package, wavelength combining at least one of the pump beams at the first wavelength with at least one of the pump beams at the second wavelength to form one or more combined pump beams, and receiving the combined pump beams in a pump fiber coupled to the diode laser package. Laser systems can include multi-wavelength pump modules and a gain fiber having a core actively doped so as to have an absorption spectrum corresponding to the multiple wavelength, the gain fiber situated to receive the pump light and to produce an output beam at an output wavelength.

Spectrally multiplexing diode pump modules to improve brightness

A high power diode laser module is provided with improved high temperature handling and reliability, the module including a housing made of a thermally conductive material and providing a module interior extending between a plurality of housing surfaces, at least one diode laser disposed in the module interior and situated to emit a laser beam, one or more optical components disposed in the module interior and coupled to the at least one diode laser so as to change one or more characteristics of the laser beam, a waveguide in optical communication with the module interior and situated to receive the laser beam from the one or more optical components, and an optical absorber disposed in the housing and situated to receive stray light which is associated with the laser beam and which is propagating in the module interior so as to absorb the stray light and conduct heat associated with the stray light away from the module interior and into the housing.

Optical loss management in high power diode laser packages

A laminated wafer sensor structure includes a housing layer having pocket openings formed therein, a circuit layer having a sensor element and electronic components mounted for registration with the pocket openings in the housing layer, and a rigid back layer. The laminated structure is suitable for handling by conventional robotic wafer handling systems. The wafer sensor structure is adapted for electrical connection to a base station that is also adapted for connection to a host computer system to facilitate communication among the sensor structure, the base station and the host computer.

Growing community of inventors

Camas, WA, United States of America

Wolfram Urbanek