Infineon Technologies Ag

Wolfram Eurskens

Michael Bauer

Peter Strobel

Heinz Pape

Rudolf Kerler

Stephan Stoeckl

Gerold Gruendler

An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

Electronic module and method for the production thereof

The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

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Unterhaching, Germany

Wolfram Eurskens