Hilti Aktiengesellschaft

Materials Resources International

Wolfgang Tillmann

Erich Lugscheider

Walter Ritt

Johann Dorfmeister

Hongshou Zhuang

Eugen Magyari

Martin Goedickemeir

Manfred Horst Boretius

A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum; either at least 0.01% or 0.01&#x2013;10% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); either at least 0.5% or 0.5&#x2013;10% by weight of an element or a mixture of elements selected from the group consisting of silver, copper, and indium; optionally either at least 0.01% or 0.01&#x2013;1% by weight of gallium; and a remainder consisting of tin, lead, or of a mixture of tin and lead.

Method for joining workpieces using soldering alloy

An abrasive cutter formed of at least one diamond particle, preferably at least one mono-diamond crystal and metallic binder material distinguished by the fact that the diamond particle (D) has a size of about 50 &mgr;m to about 500 &mgr;m and each diamond particle (D) is enclosed by a coating (H) produced in a fluidized bed with the coating having a wall thickness of about 10 &mgr;m to about 200 &mgr;m. The volume of the coating (H) constitutes at least 30% of the volume of the diamond particles (D) in the fully consolidated state following individual sintering of the coated diamond particles (D, H). The abrasive cutters can be applied directly onto an abrasive tool. Further they can be processed to form composite cutters or cutting segments. In the method of forming the abrasive cutter, the diamond particle (D) is brought into a fluidized bed reactor and enclosed in a metallic coating (H). Coated diamond particle (D, H) can be processed into larger cutters or segments in each case individually sintered and fixed directly on an abrasive tool.

Abrasive cutter containing diamond particles and a method for producing the cutter

The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. The alloy proposed is characterized in that it contains at least 1% by wt. of an element or a mixture of elements from sub-group IVa and/or Va in the periodic table, at least 0.01% by wt. of an element or a mixture of elements from the lanthanide series; optionally at least 0.5% of silver or copper or indium or a mixture silver and/or copper and/or indium; and optionally at least 0.01% by wt. of gallium, the remainder consisting of tin or lead or a mixture of tin and lead plus, as applicable, the usual impurities. The alloy proposed can be used as solder in oxygen-containing atmospheres such as air, can be used at relatively low temperatures and efficiently wets normally difficult to wet surfaces such as ceramic surfaces. In a further embodiment of the invention, the solder alloy can be used without flux.

Alloy, in particular a solder alloy, for joining workpieces

A composite cutting tool for use in the abrasive processing of hard substrates comprising cutting elements wherein diamond particles in a predominantly metallic binder material are agglomerated and sintered during an individual molding process of each of said cutting elements.

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Nüziders, Austria

Wolfgang Tillmann