Infineon Technologies Ag

Siemens Aktiengesellschaft

Delo Industire Klebstoffe Gmbh + Co. Kg

Wolfgang Schindler

Frank Pueschner

Peter Stampka

Jens G Pohl

Juergen Hoegerl

Frank Puschner

Alfred Haimerl

Frank Püschner

Andreas Mueller-Hipper

Dietmar Dengler

Claus Bruedigam

Ewald Simmerlein-Erlbacher

Klaus Eppinger

Thomas Spöttl

Alfred Hoss

Laurent Pavy

Timo Lisk

Bettina Latka

A dual interface smart card having a smart card body, a contact-based interface for contact-based communications, a first security chip which is arranged in the smart card body and is electrically conductively coupled to the contact-based interface, a fingerprint sensor arranged in the smart card body, a second security chip, which is coupled to the fingerprint sensor and is configured to carry out a fingerprint verification by means of fingerprint signals detected by the fingerprint sensor, and an antenna coupled to the second security chip.

Dual interface smart card and method for forming a dual interface smart card

A smart card module includes a substrate having a first main surface and a second main surface, which is opposite the first main surface. The substrate has a plurality of plated-through holes, which extend through the substrate from the first main surface to the second main surface. The smart card module further includes a chip over the first main surface of the substrate, a first metal structure over the second main surface of the substrate, electrically insulating material, which covers the first metal structure, and a second metal structure over the electrically insulating material, wherein the second metal structure is electrically insulated from the first metal structure by the electrically insulating material. The chip is connected to the first metal structure by at least one first plated-through hole. The chip is connected to the second metal structure by at least one second plated-through hole.

Smart card module, smart card, and method for producing a smart card module

A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.

Smart card module and method for producing a smart card module

In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first and second major surface, or side, thereof. An integrated circuit affixed to the second side is oriented with chip pads facing away from the substrate. Wire bonds may connect the chip pads to the metallizations.

Chip card module

A method for producing a contact zone for a chip card has the following steps. A sheet having a first surface and a second surface opposite the first surface. Forming at least one insulating trench, which extends from the first surface to the second surface. A cluster layer is applied to the first surface. The second surface is connected to a carrier element after the cluster layer has been applied to the first surface.

Method for producing a chip card contact zone

A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.

Chipcard with contact areas and method for producing contact areas

A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.

Chip module

A chip card module having a carrier with contact areas. Arranged on the carrier lying opposite the contact areas is a semiconductor chip, which has an integrated circuit which has on a surface of the chip terminal contacts which are connected in an electrically conducting manner to assigned contact areas. The contact areas have a first conducting layer and a second conducting layer, with cluster elements embedded in the second conducting layer.

Two accelerator pedal position sensors independently sense the position of an accelerator pedal driving an internal combustion engine. A first emergency running mode of the internal combustion engine is set if a failure is detected of either the first or the second pedal position sensor. In the first emergency running mode, the torque at a shaft of the drive train is limited to an emergency running mode torque which depends on at least one operating variable.

Method for controlling an internal combustion engine

A radar method and a device for carrying out the method include estimating an azimuth angle of each target object from determined variables of distance or range, relative speed and relative acceleration after Kalman filtering and separating out target objects having a physically impossible behavior (tracking and prediction). That is used to determine which target objects are located on a roadway occupied by a vehicle and which are the most dangerous thereof. Indication, warning or action thresholds are determined as a function of driving behavior of the driver, road conditions and weather conditions. Indication, warning or action signals (in the brakes, throttle valve or gear shift of the vehicle) result if the thresholds are exceeded or undershot by the range, the relative speed and the relative acceleration.

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Regenstauf, Germany

Wolfgang Schindler