Other

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Wls Karl-heinz Grasmann

Wls Karl-heinz Grasmann Weichlotanlagen-und Service

Wolfgang Scheel

Heinrich Meyer

Hans-Jurgen Albrecht

Wilfred John

Volker Liedke

Harald Wittrich

Walter Schmidt

Herbert Reichl

Dieter Oesterhelt

Stefan Fiedler

Karl-Heinz Grasmann

Frank Rudolf

Karl H Grasmann

Ewald Losert

Theis Zur Nieden

G&uuml;nter R&ouml;hrs

Helmut Leicht

Willi Hafner

Hans-J&uuml;rg Barte

Karl Ring

The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (,), power supplying substrate parts (,), mechanical substrate parts (,), as well as the arrangement of components (,) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (,), components (,) and mechanical stiffening elements (,) has the following structure. The substrate parts with the fine, dense and flexible elements are associated with the inner areas of the overall circuit, the substrate parts with the rigid elements and/or components are associated with the outer areas of the overall circuit and a stiffening support material is so placed in the outer area that the circuit is given a mechanical support structure, which is designed in locally rigid manner passing into flexible areas. The overall circuit is folded and/or wound corresponding to the rigid and flexible portions. The mechanical support structure can be formed by separately produced apparatus housing parts or by the apparatus housing.

Connection substrate

The invention relates to the production of thin metal layers and structures thereof on substrates of various structures. The lateral extent of a metal layer on the respective substrate can be prescribed with a precision in the micron and submicron range. The method described makes it possible to manufacture flat and three-dimensional metal structures on smooth planar or curved surfaces, as are required, for example, for depicting writing or drawings. The method uses no printing techniques.

Method to prepare the production of structured metal coatings using proteins

Process and device for the wave or vapor-phase soldering of electronic

In the process according to the invention for soldering electronic boards, in particular, printed circuit boards with devices installed on them, first, during the pickling process, a condensable process material, for example, water, is introduced into flaws in the oxide layers on the soldering connection surfaces and at least partially condensed in the flaws. Then, the oxide layers are exposed to rapid heating such that the process material condensed in the flaws vaporizes explosively and thus the oxide layer breaks up and cracks off of the basis material, such that the soldering connection surfaces for the subsequent actual soldering process are brought to virgin condition. In the case of wave soldering, the rapid heating occurs preferably by means of the wave of solder itself. If non-oxide passive layers must also be removed, this occurs preferably in a preceding stage of the pickling process, during which the oxide layer is hydrophilized. For this, a plasma pretreatment is suitable. The device according to the invention has a moisturizing chamber in which the condensable process material is supplied to the hydrophilic oxide layers and absorbed by them.

Process and device for soldering electronic boards, in particular,

The invention is directed to a procedure for processing joints to be soldered, preferably printed circuit boards fitted with electric components, and an arrangement for executing this procedure, wherein the joints are subjected to plasma treatment before the soldering process. The joints may be subjected to plasma treatment separately or in the relative position necessary for the soldering process.

Procedure for processing joints to be soldered

Growing community of inventors

Berlin, Germany

Wolfgang Scheel