Ciba-geigy Corporation

Shin-etsu Chemical Co., Ltd.

Ciga-geigy Corporation

Wolfgang Scharf

Peter Flury

Kurt Meier

Theobald Haug

Toshio Shiobara

Carl W Mayer

Takayuki Aoki

Eiichi Asano

Sheik A Zahir

Maurice Dupre

Cecile Pasquier

Ennio Vanoli

Tadashi Okada

An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.

Semiconductor encapsulating epoxy resin compositions and semiconductor

The invention relates to compounds of the formula (1) ##STR1## in which m is 0 or 1, R is a hydrogen atom or a group of formula ##STR2## T is either an (m+2)-valent aromatic group or a bisphenylene group, [Z] is a group of on average 1 to 10 structural units of the formula (3)

Phosphorus-containing flameproofing agents for epoxy resin materials

Mixtures essentially comprising compounds of formula I or II ##STR1## wherein X is a hydrogen atom or vinyl, A is a divalent aromatic radical which is unsubstituted or substituted by one or more C.sub.1 -C.sub.20 alkyl groups, halogen atoms or halogen-substituted C.sub.1 -C.sub.20 alkyl groups, R.sub.1, R.sub.1 ', R.sub.2, R.sub.2 ', R.sub.3 and R.sub.3 ' are each a hydrogen atom, or R.sub.1 and R.sub.1 ', R.sub.2 and R.sub.2 ' and R.sub.3 and R.sub.3 ' are each together ethylene, R.sub.4 is C.sub.1 -C.sub.6 alkyl, phenylalkyl containing 1 to 6 carbon atoms in the alkyl moiety or is trialkylsilyl containing 1 to 6 carbon atoms in each alkyl moiety, m is 0, 1 or 2, n is 0 or an average number from 1 to 200, p is an average number from 1 to 100 and q is 0 or an average number from 1 to 100, can be cured by heating and are suitable for making laminates, especially for fabricating copper-clad circuit boards.

Mixtures of spiroheptadienes

Compounds of general formula I ##STR1## wherein X.sub.1 is chloro or bromo,

Phosphorus compounds and their use as flame retardant for polymers

A laminate prepared by combining at least two layers wherein at least one of which is made of a fibrous material, an epoxy resin having on average at least two 1,2-epoxide groups per molecule or a mixture of these epoxy resins and a ferrocene derivative of the formula [R.sup.1 (Fe.sup.II R.sup.2).sub.a ].sup.ab+ ab.[X].sup.-, wherein a and b independently of one another are 1 or 2, R.sup.1 is a .pi.-arene, R.sup.2 is a .pi.-arene or an indenyl- or cyclopentadienyl anion, X.sup..crclbar. is an anion [LQ.sub.m ].sup..crclbar. or an anion of a partly fluorinated or perfluorinated aliphatic or aromatic sulfonic acid, L is P, As or Sb, Q is fluorine or some of the Q substituents may also be hydroxyl groups, and m corresponds to a value which exceeds the valence of L by unity, subjecting the layers to compression molding at such a temperature and pressure that a liquid resin matrix is present at the beginning of this step and an initial fall in the viscosity is produced so that entrained gases can escape from the layers and crosslinking the laminated layers to obtain a rapid rise in viscosity such that the resin which flows out does not bind the compression mold.

Process for the preparation of laminates

A process for the preparation of a laminate including the steps

Growing community of inventors

Grenzach-Wyhlen, Germany

Wolfgang Scharf