Infineon Technologies Ag

Qimonda Ag

Infineon Technologies LLC

Wolfgang Rösner

Franz Hofmann

Thomas Schulz

Michael Specht

Jessica Hartwich

Christian Pacha

Ralf Peter Brederlow

Richard Johannes Luyken

Johannes Kretz

Lothar Risch

Franz Kreupl

Andrew Graham

Hans-Joachim Schulze

Anton Mauder

Holger Schulze

Erhard Landgraf

Wolfgang Hönlein

Johannes Luyken

Martin Städele

Holger Hüsken

Volker Lehmann

Martin Franosch

Dirk Manger

Herbert Schäfer

Till Schlösser

R Johannes Luyken

Lothar Risoh

Thomas Äugle

A semiconductor device includes at least one first contact region of a vertical device between a semiconductor substrate and an electrically conductive structure arranged adjacent to the semiconductor substrate, and at least one second contact region of the vertical device between the semiconductor substrate of the semiconductor device and the electrically conductive structure. The at least one first contact region is arranged adjacent to the at least one second contact region. The electrically conductive structure includes a first electrically conductive material in contact with the semiconductor substrate in an area of the at least one first contact region and a second electrically conductive material in contact with the semiconductor substrate in an area of the at least one second contact region, so that a first contact characteristic within the at least one first contact region differs from a second contact characteristic within the at least one second contact region.

Semiconductor device with different contact regions

A semiconductor device includes at least one ohmic contact region between a semiconductor substrate of the semiconductor device and an electrically conductive structure arranged adjacent to the semiconductor substrate. Further, the semiconductor device includes at least one Schottky contact region between the semiconductor substrate of the semiconductor device and the electrically conductive structure. The at least one ohmic contact region is arranged adjacent to the at least one Schottky contact region. The semiconductor substrate includes a first doping layer arranged adjacent to the electrically conductive structure. An average doping concentration of the surface region of the first doping layer in an area of the at least one ohmic contact region differs from an average doping concentration of the surface region of the first doping layer in an area of the at least one Schottky contact region by less than 10%.

Semiconductor device and method for forming a semiconductor device

An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs.

Integrated circuit arrangement with capacitor and fabrication method

A semiconductor memory device comprises a plurality of memory cells, each memory cell having a respective transistor. The transistor comprises a transistor body of a first conductivity type, a drain area and a source area each having a second conductivity type, wherein said drain area and source area are embedded in the transistor body on a first surface of said transistor body, a gate structure having a gate dielectric layer and a gate electrode. Said gate structure is arranged between said drain area and said source area. An emitter area of said first conductivity type is provided wherein said emitter area is arranged on top of said drain area.

Semiconductor memory device

An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs. Alternately, a FET is present in which: a channel region is the active region, the FET contains a web with opposing control electrodes connected by a connecting region that is isolated from the channel region by a thick insulating region. The thick insulating region is thicker than control electrode insulation regions. The control electrodes contain the same material as the far electrode region.

The invention relates to a vertical integrated component, a component arrangement and a method for production of a vertical integrated component. The vertical integrated component has a first electrical conducting layer, a mid layer, partly embodied from dielectric material on the first electrical conducting layer, a second electrical conducting layer on the mid layer and a nanostructure integrated in a through hold introduced in the mid layer. A first end section of the nanostructure is coupled to the first electrical conducting layer and a second end section is coupled to the second electrical conducting layer. The mid layer includes a third electrical conducting layer between two adjacent dielectric partial layers, the thickness of which is less than the thickness of at least one of the dielectric partial layers.

Vertically integrated field-effect transistor having a nanostructure therein

A nanotube array and a method for producing a nanotube array. The nanotube array has a substrate, a catalyst layer, which includes one or more subregions, on the surface of the substrate and at least one nanotube arranged on the surface of the catalyst layer, parallel to the surface of the substrate. The at least one nanotube being arranged parallel to the surface of the substrate results in a planar arrangement of at least one nanotube. Therefore, the nanotube array of the invention is suitable for coupling to conventional silicon microelectronics. Therefore, according to the invention it is possible for a nanotube array to be electronically coupled to macroscopic semiconductor electronics. Furthermore, the nanotube array according to the invention may have an electrically insulating layer between the substrate and the catalyst layer. This electrically insulating layer preferably has a topography which is such that the at least one nanotube rests on the electrically insulating layer at its end sections and is uncovered in its central section. As a result of the surface of the at least one nanotube being partly uncovered, the uncovered surface of the nanotube can be used as an active sensor surface. For example, the uncovered surface of the nanotube can come into operative contact with an atmosphere which surrounds the nanotube array. The electrical resistance of a nanotube changes significantly in the presence of certain gases. Thus because the nanotube is clear and uncovered, the nanotube array can be used in many sensor applications.

Nanotube array and method for producing a nanotube array

A DRAM memory cell is provided with a selection transistor, which is arranged horizontally at a semiconductor substrate surface and has a first source/drain electrode, a second source/drain electrode, a channel layer arranged between the first and the second source/drain electrode in the semiconductor substrate, and a gate electrode, which is arranged along the channel layer and is electrically insulated from the channel layer, a storage capacitor, which has a first capacitor electrode and a second capacitor electrode, insulated from the first capacitor electrode, one of the capacitor electrodes of the storage capacitor being electrically conductively connected to one of the source/drain electrodes of the selection transistor, and a semiconductor substrate electrode on the rear side, the gate electrode enclosing the channel layer at at least two opposite sides.

DRAM memory cell

Integrated circuit arrangement with capacitor

A nonvolatile memory cell, memory cell arrangement, and method for production of a nonvolatile memory cell is disclosed. The nonvolatile memory cell includes a vertical field-effect transistor (FET). The FET contains a nanoelement arranged as a channel region and an electrically insulating layer. The electrically insulating layer at least partially surrounds the nanoelement and acts as a charge storage layer and as a gate-insulating layer. The electrically insulating layer is arranged such that electrical charge carriers may be selectively introduced into or removed from the electrically insulating layer and the electrical conductivity characteristics of the nanoelement may be influenced by the electrical charge carriers introduced into the electrically insulating layer.

Non-volatile memory cell, memory cell arrangement and method for production of a non-volatile memory cell

A semiconductor substrate and a semiconductor circuit formed therein and associated fabrication methods are provided. A multiplicity of depressions with a respective dielectric layer and a capacitor electrode are formed for realizing buried capacitors in a carrier substrate and an actual semiconductor component layer being insulated from the carrier substrate by an insulation layer.

Semiconductor substrate and semiconductor circuit formed therein and fabrication methods

The invention relates to a molecular electronics arrangement comprising a substrate, at least one first strip conductor having a surface and being arranged in or on the substrate, a spacer which is arranged on the surface of the at least one first strip conductor and which partially covers the surface of the at least one first strip conductor, and at least one second strip conductor which is arranged on the spacer and comprises a surface which faces the surface of the at least one first strip conductor in a plane manner. The spacer partially covers the surface of the at least one second strip conductor, and defines a pre-determined distance between the at least one first strip conductor and the at least one second strip conductor. The inventive molecular electronics arrangement also comprises molecular electronics molecules which are arranged between a free region of the surface of the at least one first strip conductor and a free region of the surface of the at least one second strip conductor, the length of said molecules being essentially equal to the distance between the at least one first strip conductor and the at least one second strip conductor. The invention also relates to a method for producing a molecular electronics arrangement.

Molecular electronics arrangement and method for producing a molecular electronics arrangement

An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is described. The integrated circuit arrangement contains an insulating region and a sequence of regions which forms a capacitor. The sequence contains a near electrode region near the insulating region, a dielectric region, and a remote electrode region remote from the insulating region. The insulating region is part of an insulating layer arranged in a plane. The capacitor and an active component are arranged on the same side of the insulating layer and form a memory cell. The near electrode region and an active region of the component are arranged in a plane which lies parallel to the plane in which the insulating layer is arranged. A processor is also contained in the integrated circuit arrangement.

Integrated circuit arrangement having capacitors and having planar transistors and fabrication method

A floating gate field-effect transistor (), which is preferably used as a memory cell, has, above or below a floating gate region (), an electrically insulating layer sequence () having a lower layer () having a first relative permittivity, having a middle layer () having a second relative permittivity, and having an upper layer () having a third relative permittivity, the second relative permittivity being greater than the first relative permittivity and greater than the third relative permittivity.

Floating gate field-effect transistor

A vertical semiconductor transistor component is built up on a substrate by using a statistical mask. The vertical semiconductor transistor component has vertical pillar structures statistically distributed over the substrate. The vertical pillar structures are electrically connected on a base side thereof to a first common electrical contact. The vertical pillar structures include, along the vertical direction, layer zones of differing conductivity, and have insulation layers on their circumferential walls. An electrically conductive material is deposited between the pillar structures and forms a second electrical contact of the semiconductor transistor component. The pillar structures are electrically contacted to a third common electrical contact on their capping side.

Growing community of inventors

Ottobrunn, Germany

Wolfgang Rösner