Infineon Technologies Ag

Infineon Technologies Austria Ag

Wolfgang Peinhopf

Ralf Otremba

Michael Treu

Uwe Kirchner

Andreas Schloegl

Marco Seibt

Josef Hoeglauer

Teck Sim Lee

Matteo-Alessandro Kutschak

Fabio Brucchi

Josef Höglauer

Mario Feldvoss

Jürgen Schredl

Guenther Lohmann

Mario Veldvoss

A semiconductor package includes a base, a die attached to the base, a lead and a connector electrically connecting the lead to the die. A mold compound encapsulates the die, the connector, at least part of the base, and part of the lead, so that the lead extends outward from the mold compound. An electrical insulation layer separate from the mold compound is attached to a surface of the mold compound over the connector. The electrical insulation layer has a fixed, defined thickness so that the package has a guaranteed minimum spacing between an apex of the connector and a surface of the electrical insulation layer facing away from the connector.

Semiconductor package with top-side insulation layer

Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches.

Packaged device comprising non-integer lead pitches and method of manufacturing the same

An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.

Electronic device and manufacturing thereof

Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof

Growing community of inventors

Viktring, Austria

Wolfgang Peinhopf