Epcos Ag

Tdk Corporation

Siemens Aktiengesellschaft

Snaptrack Incorporated

Siemens Matsushita Components Gmbh & Co Kg

Rf360 Technology (wuxi) Co., Ltd.

Epcos Ac

Wolfgang Pahl

Anton Leidl

Alois Stelzl

Gregor Feiertag

Hans Krueger

Jürgen Portmann

Christian Bauer

Hans Krüger

Hans Kr&uuml;ger

Christian Siegel

Stefan Seitz

Pirmin Hermann Otto Rombach

Heiner Bayer

Kurt Rasmussen

Hans Kruger

Walter Fischer

Ulrich Wolff

Friedrich Lupp

Werner Ruile

Karl Weidner

Jan Tue Ravnkilde

Dennis Mortensen

Florian Eder

Klaus Mayer

Winfried Plundrich

Jurgen Machui

Peter Zibis

Marcel Giesen

Matthias Jungkunz

Andreas Barbul

Robert Koch

Morten Ginnerup

Armin Schober

Juergen Portmann

Matthias Uebler

Karl Nicolaus

Sven Pihale

Hans Stelzl

Matthias Winter

Bruno F&uuml;rbacher

Peter Demmer

Andreas Beer

Thomas Telgmann

Stefan Stufler

Feng Zhang

G&uuml;nter Trausch

Gunter Trausch

Bruno Furbacher

Robert Eichinger

Thomas Wassner

Thomas Sedlmeier

Hans KRÜGER

In an embodiment a lid includes a top section and a side section arranged below the top section. A vertical height of the top section is calculated by I*H, Ibeing a first multiple integer and Hbeing a basic height, and a vertical height of the side section is calculated by I* H, Ibeing a second multiple integer and HB being the basic height H.

Lid, MEMS sensor component and methods of manufacturing

A MEMS sensor with a media access opening in its carrier board. The MEMS sensor has an integrally filter mesh closing the media access opening. The mesh can be applied in unstructured form over the whole surface of the carrier board. Then, a structuring is performed to produce preferably at the same time a perforation forming the filter mesh.

MEMS device with particle filter and method of manufacture

In an embodiment an electronic device includes a carrier board having an upper surface, an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a flexible mounting layer arranged between the upper surface of the carrier board and the mounting side of the electronic chip, the flexible mounting layer mounting the electronic chip to the carrier board, wherein the mounting side has at least one first region and a second region, and wherein the electronic chip has at least one chip contact element in the first region and at least one connection element arranged on the at least one first region and connecting the at least one chip contact element to the upper surface of the carrier board, wherein the flexible mounting layer separates the second region from the connection element.

Electronic device and method for manufacturing an electronic device

An electronic device with stud bumps is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, wherein the carrier board has at least one recess in the upper surface, and wherein at least one of the stud bumps reaches into the recess.

Electronic device with stud bumps

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

A carrier substrate and a method for making a carrier substrate are disclosed. In an embodiment a carrier substrate includes a substrate body having a multilayer structure, electrical connection pads on a top surface of the substrate body, an organic cushion layer on the top surface of the substrate body, electrically conductive elongated parts arranged on top of the cushion layer, wherein each conductive elongated part is contacted to a respective electric connection pad and a solder pad located at an end of each elongated part distant from the respective connection pad.

Carrier substrate for stress sensitive device and method of manufacture

A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

MEMS device stress-reducing structure

A method for measuring a behavior of a MEMS device is disclosed. In an embodiment a method includes mounting the MEMS device to a testing apparatus that comprises a vibration source, wherein the MEMS device comprises a 6-axis or 9-axis inertial sensor, applying a vibration to the MEMS device by the vibration source and simultaneously moving the testing apparatus according to a predefined movement pattern, reading output data provided by the inertial sensor and comparing the output data to the predefined movement pattern and/or reading output data provided by the inertial sensor and calculating a frequency response curve of the inertial sensor.

Method for measuring a behavior of a MEMS device

An electronic device is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface of the carrier board, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, and wherein a laminated polymer hood at least partly covers the top side of the electronic chip and extends onto the upper surface of the carrier board.

A MEMS device having a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.

Resiliently mounted sensor system with damping

A sensor component having a MEMS sensor and an ASIC for one sensor function each. A base element, a wall element in the form of a frame and a cover together enclose a cavity of a housing. The MEMS sensor is mounted inside the cavity on the base element of the housing. The ASIC has an active sensor surface and is mounted on or under the cover or is embedded in the cover. Electrical external contacts for the MEMS sensor and ASIC are provided on an external surface of the housing. The cavity has at least one opening or bushing.

Sensor component having two sensor functions

A housing for an electric component and a method for producing a housing for an electric component are disclosed. In an embodiment the housing includes a first housing part and a second housing part, wherein the first housing part is connected to the second housing part in a joining region, and wherein the joining region is at least partially covered by a coating containing sprayed-on particles.

Housing for an electric component, and method for producing a housing for an electric component

A housing and a method for manufacturing a housing are disclosed. In an embodiment a housing for an electric component includes a first housing part and a second housing part, wherein the first housing part and the second housing part are connected in a joining region, wherein the joining region is completely or partially covered by a metallic coating on an outside, wherein the first housing part is joined to the second housing part by a connecting agent, wherein the connecting agent is an adhesive or a solder material, wherein the metallic coating covers the first housing part only at an upper side of the first housing part accessible from the outside when the housing parts are joined by the connecting agent, and wherein the metallic coating extends laterally beyond the first housing part and at least partially covers the second housing part.

Housing used for electric component and method for manufacturing same

A microphone having a housing including a bottom part and an upper part, and a transducer element which is arranged in the housing and is electrically and mechanically connected to the bottom part. For stress-free mounting of the transducer element, a flexible connecting element is proposed, which is pliable and/or compressible, is arranged between the transducer element and the upper part, and connects the transducer element to the upper part. The connecting element comprises a plastic, in which gas bubbles are distributed, the gas bubbles having a volume fraction of between 50 and 98% in the connecting element.

Top port microphone and method for the production of same

A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

MEMS component and method for encapsulating MEMS components

Growing community of inventors

Munich, Germany

Wolfgang Pahl