Osram Ag

Osram Gesellschaft MIT Beschraenkter Haftung

Osram Gmbh

Osram Gesellschaft MIT Beschrankter Haftung

Ledvance Gmbh

Osram S.p.a. - Societa' Riunite Osram Edison Clerici

Wolfgang Pabst

Robert Kraus

Bakuri Lanchava

Ulrich Henger

Henning Rehn

Thomas Noll

Ralph Bertram

Harald Stoyan

Giovanni Scilla

Jan Oliver Drumm

Roland Huettinger

Philipp Erhard

Gerhard Mitic

Rui Ma

Steffen Straub

Xiyuan He

Lai Qian Cen

Chao Hong Du

Xiyuan Second Light Industrial Estate He

Rui Second Light Industrial Estat Ma

In a method for projecting an image onto a projection area () by at least one first () and second () beam, in order to create an improved image on the projection area, the deviation of the projection of the first and second beam on the projection area is determined, and the intensity of the first and/or second beam is varied over time according to the previously determined deviations.

Projection apparatus having improved projection properties, and method and procedure, respectively, for projecting an image

An LED lamp may include at least one support equipped with at least one LED, a lamp base, at least one circuit component, interposed between the lamp base and the at least one LED, for operating the at least one LED, and a lamp body made of optically transmissive material with a recess for holding at least that part of the support which carries the at least one LED, the lamp body having surface structuring for cooling by thermal convection, wherein the surface structuring comprises a multiplicity of elevations, and wherein the elevations are respectively designed in the form of islands.

LED lamp

A lighting device () comprising at least one light source (), at least one base () thermally and electrically operationally connected to the light source (), and at least one bulb fitting () provided for receiving the base (). The base () has at least one first heat transfer surface () and the bulb fitting () has at least one second heat transfer surface () in contact with the first heat transfer surface () either directly or by way of a foil (). At least one device () is provided for exerting a predefined press force between the first heat transfer surface () and the second heat transfer surface ().

Lighting device having a socket and bulb fitting

A lamp may include at least one housing; a heat source connected thereto; and a base for connection to a lampholder, wherein the base has at least one heat dissipation surface, and wherein at least one heat source is thermally conductively connected to at least one heat dissipation surface.

Lamp

An illumination device is specified which includes a radiation source having at least one light-emitting diode, a control unit and a radiation receiving unit. The radiation receiving unit is provided, during operation of the illumination device for receiving both a radiation emitted by the radiation source and a reference radiation and for generating a measurement signal upon receiving the radiation from the radiation source and a reference signal upon receiving the reference radiation. An operating point for the radiation source is tunable by the control unit in a manner dependent on the measurement signal and the reference signal. Furthermore, a method is specified by which an emission characteristic of an illumination device can be adapted to a predetermined emission characteristic in a simplified manner.

Illumination device and method for adapting an emission characteristic of an illumination device

A light module has at least one light source mounted on a base, especially an LED, a housing to accommodate the base, an electrical connection element for power supply of at least one light source. An outer line of the connection element is formed by the housing, and an inner line, especially center line, of the connection element, which is at least partially enclosed by the outer line, contacts the base.

Light module

A mounting panel arrangement having a plurality of mounting panels for optoelectronic components. Two adjacent mounting panels () are connected to one another, in a mechanically stable manner, a connection body (). Each of the two mounting panels has a connection area (), each of which is associated with an attachment section () of the connection body. For each connection area, a plug connection is formed between the connection area and the associated attachment section.

Mounting panel arrangement

An LED lamp has a lamp base and a support connected to the lamp base, on which at least one LED is mounted, the support including at least one hollow element, each with at least two air passage openings to permit an air flow through a cavity of at least one hollow element.

A semiconductor lamp having a light-emitting semiconductor device, the semiconductor device comprising a carrier and at least one light-emitting semiconductor component on the carrier, and a heatsink. The heatsink has a first main face, the semiconductor device is located adjacent to the first main face, and the carrier faces the first main face. The semiconductor device is thermally coupled to the heatsink, and the heatsink has at least one feedthrough for electrical connection of the semiconductor device.

Semiconductor lamp

A lamp base assembly with electronic ballast for energy-saving lamp includes a housing (), a lamp cap () and an electronic ballast () with transistors () provided within the housing. A transistor heat-diffusing element surrounding each transistor is provided within the lamp base, for enhancing the heat transfer from the transistors to the housing or the lamp cap, so that the heat generated from the transistors could be transferred out of the lamp base assembly. Thus, the heat-diffusing ability of the transistors is improved, and the working temperature of the transistors could be kept within a safe scope, so that the lifetime of the energy-saving lamp is guaranteed.

Growing community of inventors

Deisenhofen, Germany

Wolfgang Pabst