Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Wolfgang Moench

Frank Singer

Thomas Schwarz

Stefan Illek

Alexander Linkov

Siegfried Herrmann

Matthias Sabathil

Jürgen Moosburger

Britta Goeoetz

Georg Dirscherl

Juergen Moosburger

Sandra Sobczyk

An optoelectronic component includes an optoelectronic semiconductor chip having a radiation-emitting face; and an optical element arranged over the radiation-emitting face, wherein the optical element includes a material in which light-scattering particles are embedded, and a concentration of the embedded light-scattering particles has a gradient forming an angle not equal to 90&#xb0; with the radiation emission face.

Optoelectronic component, optoelectronic arrangement, method of producing an optical element, and method of producing an optoelectronic component

A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.

Method of producing an optoelectronic component, and optoelectronic component

The invention relates to a lighting means (), comprising: an optical element (), which has a main extension direction (Z), a radiation inlet surface (), and a radiation outlet surface (); and at least two light-emitting diodes (), which each comprise at least one light-emitting diode chip () and a radiation passage surface (), which extends along a main extension plane (XZ); wherein the at least two lighting-emitting diodes () are arranged along the main extension direction (Z) of the optical element (), the radiation inlet surface () of the optical element () faces the radiation passage surfaces () of the at least two light-emitting diodes (), the optical element () is formed as a solid body, the radiation inlet surface () of the optical element () is flat or convexly curved, and the radiation outlet surface () of the optical element () comprises at least one recess () in the optical element ().

Lighting means having a specifiable emission characteristic and production method for an optical element

A method for producing a plurality of optoelectronic components () comprises the steps: providing a semiconductor body () that is arranged on a carrier (); and applying a converter material () to the semiconductor body () by means of a photoconductive transfer element ().

Method for producing an optoelectronic component

An optoelectronic semiconductor component includes one or more light-emitting diode chips. The light-emitting diode chip has a main radiation side. A diaphragm is arranged downstream of the main radiation side along a main radiation direction of the light-emitting diode chip. The diaphragm is mounted on or in a component housing. The main radiation side has a mean edge length of at least 50 &#x3bc;m. The diaphragm can be switched from light-impervious to light-pervious. The diaphragm comprises precisely one opening region for radiation transmission. The semiconductor component can be used as a flashlight for a mobile image recording device.

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Pentling, Germany

Wolfgang Moench