Deutsche Gold- Und Silber-scheideanstalt Vormals Roessler

Degussa Aktiengesellschaft

Wolfgang Koehler

Walter Diehl

In order to produce hard solderable metal coatings on a ceramic there is applied to the ceramic base a thin layer of a palladium alloy containing 20-70% of cobalt and/or iron. The coating is preferably applied by vapor deposition or sputtering. The adhesiveness of the coatings is still further improved if there is added to the alloy 3-20% of chromium, manganese and/or titanium.

Hard solderable metal layers on ceramic

Light metal surfaces, particularly of aluminium, magnesium, titanium, beryllium and their alloys are pretreated before galvanization electroplating in aqueous solution by applying a layer of a palladium alloy with cobalt and/or iron and/or nickel.

Process for pretreatment of light metals before galvanization

There is provided a means for measuring resistance for a resistance thermometer consisting of an insulating former as a carrier and a thin platinum layer as resistance material, the carrier for the platinum layer being made of a material having a greater thermal coefficient of expansion than platinum over the range between 0.degree. and 1000.degree. C.

Resistance element for resistance thermometer and process for its

There is provided a process of producing a resistance element for a resistance thermometer consisting of a thin platinum layer on an insulating solid as a carrier, by sputtering the platinum layer on the solid in a krypton-oxygen or xenon-oxygen mixture.

Process for production of a resistance element for resistance

There is provided a resistance element comprising a cylindrical carrier body, a rectangular bore therein in the direction of the longitudinal axis, a ceramic plate within said bore and securely bound to a flat wall of said carrier body, a thin layer platinum-resistor path with a temperature dependent electrical resistance firmly adhering to the surface of the ceramic plate opposite to that bound to said carrier body, electrical lead wires connected to said resistor path, said lead wires being secured to at least one end of said carrier body by an electrically nonconducting sealing composition and said lead wires passing through said sealing composition to the outside.

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Alzenau, Germany

Wolfgang Koehler