Infineon Technologies Ag

Infineon Technologies Austria Ag

Wolfgang Klein

Stefan Barzen

Alfons Dehe

Ulrich Krumbein

Wolfgang Friza

Franz Hirler

Thorsten Meyer

Frank Dieter Pfirsch

Walter Rieger

Matthias Friedrich Herrmann

Marc Fueldner

Juergen Wagner

Giordano Tosolini

Evangelos Angelopoulos

Konstantin Tkachuk

Winfried Bakalski

Carsten Ahrens

Hans Taddiken

David Tumpold

Martin Wurzer

Alexander Glas

Stefan Geissler

Renate Hofmann

Reinhard Gabl

Thomas Goebel

Johann Strasser

Martin Seck

Markus Schwerd

Johann Helneder

Andrea Mitchell

Martina Hommel

Johannes Manz

Stefan Drexl

Adrian Berthold

Martin Seidl

Reinhard J Stengl

Martin Franosch

Armin Tilke

Rudolf Lachner

Thomas Meister

Christian Bretthauer

Uwe Seidel

Josef Boeck

Arnaud Walther

Christian Herzum

Jakob Huber

Juergen Holz

Josef Böck

Mohsin Nawaz

Wolfgang Molzer

Markus Meyer

Herbert Kebinger

Herbert Sch&auml;fer

Jürgen Holz

Heinrich Körner

Karolina Zogal

Karolina Gierl

Josef B&ouml;ck

Xu Cheng

Heinrich Kôrner

Matthias Vobl

Daniel Fruechtl

Stefan Geißler

Jürgen Wagner

Daniiel Fruechtl

In an embodiment, a method for forming a microfabricated structure includes depositing a first membrane on a substrate, depositing a first isolation layer on the first membrane, depositing a stator layer on the first isolation layer, forming a perforated stator from the stator layer, wherein the first isolation layer is disposed on a first surface of the perforated stator, depositing a second isolation layer on a second surface of the perforated stator and depositing a second membrane on the second isolation layer, including depositing a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first glass layer having a low etch rate, and a second glass layer having a high etch rate embedded in the first glass layer.

Membrane support for dual backplate transducers

A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.

Thermoresistive micro sensor device

A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

Dual membrane transducer

A MEMS pump includes a basis structure, a membrane structure opposing the basis structure and being deflectable parallel to a surface normal of the basis structure and includes a pump chamber between the basis structure and the membrane structure wherein a volume of the pump chamber is based on a position of the membrane structure with respect to the basis structure. The MEMS pump includes a passage for letting a fluid pass into the pump chamber or exit the pump chamber, wherein the passage is arranged in-plane with respect to the pump chamber. The MEMS pump includes a valve structure coupled to the passage for connecting, in a first state, the passage to a first outer volume and for connecting, in a second state, the passage to a second outer volume.

Thin MEMS pump with membrane and valve lip structure

A system for measuring gas concentration includes a package having a cavity and a port, a photoacoustic gas sensor device within the package, and a Micro Electro Mechanical System ('MEMS') valve separate from the photoacoustic gas sensor device placed over the port of the package and to allow ambient gas diffusion into the cavity in a first mode of operation, and to prevent ambient gas diffusion into the cavity and to acoustically isolate the cavity in a second mode of operation.

Photoacoustic sensor valve

A micro electrical mechanical systems (MEMS) device includes a flexible membrane disposed over a substrate, and a first backplate disposed over the flexible membrane. The first backplate includes a first plurality of bumps facing the flexible membrane. The MEMS device further includes a plurality of features disposed at the flexible membrane, where each of the plurality of features being associated with a corresponding one of the first plurality of bumps.

MEMS devices

A MEMS-transducer comprises a membrane structure having a first main surface and a second main surface opposing the first main surface. A substrate structure holds the membrane structure, wherein the substrate structure overlaps with the first main surface of the membrane structure in a first edge region being adjacent to a first inner region of the first main surface. A gap is formed between the membrane structure and the substrate structure in the first edge region and extends from the first inner region into the first edge region.

MEMS-transducer and method for producing a MEMS-transducer

A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

A MEMS sound transducer includes a backplate and a membrane held by an edge fixing such that the membrane is deflectable along a deflection direction toward the backplate. The MEMS sound transducer further includes an elevation element arranged between the membrane and the backplate and having a first height along the deflection direction. The MEMS sound transducer also includes a supporting structure and a spacer element arranged between the membrane and the supporting structure and having a second height along the deflection direction, the second height being greater than the first height. The supporting structure is the backplate or is a supporting element arranged opposite the backplate, such that the membrane is arranged between the backplate and the supporting element.

MEMS sound transducer, MEMS microphone and method for providing a MEMS sound transducer

A microelectromechanical system includes a housing with an access opening and a sound transducer with a membrane and a backplate, wherein the sound transducer is coupled to the access opening. The microelectromechanical system includes a filter arranged between the access opening and the sound transducer and includes a filter material and a pretension element, the pretension element being mechanically connected to the filter material, and wherein the pretension element produces stress in the filter material in order to provide a bending deformation of the filter in a direction away from the backplate.

Microelectromechanical system

According to an embodiment, a microfabricated structure includes a cavity disposed in a substrate, a first clamping layer overlying the substrate, a deflectable membrane overlying the first clamping layer, and a second clamping layer overlying the deflectable membrane. A portion of the second clamping layer overlaps the cavity.

System and method for a microphone

In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed.

Semiconductor devices having a membrane layer with smooth stress-relieving corrugations and methods of fabrication thereof

A method for forming a microelectromechanical device may provide forming a first layer at least one of in or over a semiconductor carrier; forming a second layer at least one of in or over at least a central region of the first layer, such that a peripheral region of the first layer is at least partially free of the second layer; removing material under at least a central region of the second layer to release at least one of the central region of the second layer or a central region of the first layer; and/or removing material under at least the peripheral region of the first layer to such that the second layer is supported by the semiconductor carrier via the first layer.

Method for forming a microelectromechanical device

Growing community of inventors

Zorneding, Germany

Wolfgang Klein