Siemens Aktiengesellschaft

Wolfgang Kleeberg

Roland Rubner

Heinz Hacker

Klaus-Robert Hauschildt

Eberhard Kuhn

Klaus Kretzschmar

Dieter Wilhelm

Wieland Bartel

Hellmut Ahne

Wolfgang Rogler

Wolfgang Von Gentzkow

Helmut Markert

Johann Kammermaier

Hans Kruger

Walter Ihlein

Gerhard Rittmayer

Willi Mertens

Rudolf Wiedenmann

Rolf-Winfried Schulte

Helmuth Markert

Helmut Ahne

Wolfgang V Gentzkow

Maximilian Hodl

Heinz K Laupenmuhlen

Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C.sub.1 to C.sub.4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.

Epoxy resin molding compounds

Prepregs can be prepared by impregnating reinforcement materials such as glass, carbon or plastic (in the form of fibers or nonwoven or woven materials) with a solution of a polyepoxy resin and a polyamine as a hardener and subsequent drying. For the manufacture of storage-stable prepregs based on polyepoxy resins, 1,3,5-tris(3-amino-4-alkylphenyl-2,4,6-trioxo-hexahydrotriazine with a C.sub.1 - to C.sub.4 alkyl radical is used as the hardener. The new method leads to storage-stable prepregs and assures that composite materials, especially circuit boards, manufactured therefrom meet the requirements for these materials.

Method for the manufacture of prepregs and their use

Electrically insulating composite materials formed from (1) epoxy resins and (2) polymeric fiber reinforcement which have high strength are formed if the cross-linking of the epoxy resin is accomplished by anionic polymerization using tertiary amines of the formula ##STR1## as catalyst.

Method for manufacturing electrical insulating composite materials

Glow polymerisate layers can be generated on a substrate, starting from hydrocarbons and/or fluorocarbons, by means of a high-frequency, low-pressure glow discharge. Glow polymerisates completely saturated with hydrogen or fluorine are obtained when the glow discharge is carried out in the microwave range between 0.5 and 1.000 GHz and if the amplitude E.sub.0 of the effective field strength in the vicinity of the substrate no greater than 850 V/cm.

Method for producing glow polymerisate layers

Improved printed circuit boards of laminated thermosetting sheets with epoxy resin as the bonding agent contain for inhibiting copper migration 0.1% to 10% N,N'-bis-salicyloyl hydrazine, based on the weight of the hardened epoxy resin.

Printed circuit boards of laminated thermosetting sheets

The invention relates to a method for the preparation of thin polyimide layers by applying a solution of a polyimide prepolymer to a substrate, and subsequently annealing, and has as its object the provision of a method of this type in such a way that the preparation of layers with layer thicknesses of .ltoreq.0.2 .mu.m is made possible which layers have a homogeneous character and exhibit good adhesion. For this purpose, the invention provides that film-forming prepolymers of highly heat-resistant polyimides are used which prepolymers give off a high percentage of volatile products in annealing. The method according to the invention is particularly suitable for the production of orientation layers for liquid-crystal displays.

Method for the preparation of thin polyimide film

This application relates to methods for the manufacture of leakage current-proof epoxy-resin molded materials from epoxy resin mixture based on di- or polycarboxylic-acid glycidyl esters, di- or polyfunctional cycloaliphatic olefinic epoxides and dicarboxylic-acid anhydrides, carried out in such a manner that molded materials with good mechanical properties are obtained also for parts of large volume. For this purpose, the invention provides that, by means of the experimentally determined time necessary to reach the maximum temperature during the cross-linking of the epoxy resin mixture under quasi adiabatic conditions, the rate of cross-linking of the epoxy resin mixture is adjusted, by the addition of a diol or polyol, to at least as long as the time necessary to reach the maximum temperature during cross-linking of the glycidyl ester/dicarboxylic acid anhydride components.

Method for manufacturing epoxy resin molded materials

Molding materials, laminates, stratified material and cover or protective layers which are of high electrical and mechanical quality are formed from polymerisable epoxy compounds if the corss-linking of the epoxy resins is accomplished by anionic polymerisation, using mixed catalysts of tertiary amines of the formula: ##STR1## and an imidazoles of the formula: ##STR2## as a polymerisation catalysts.

Method for the manufacture of epoxy resin molding materials

The invention relates to a method for cross-linking radically cross-linkable polymers and for stabilizing such polymers against oxidative and/or thermal decomposition. The method is developed so that rapid and economical cross-linking of radically cross-linkable polymers is obtained in the presence of oxidation inhibitors without adverse effects on the cross-linking process due to the oxidation inhibitor. For this purpose, the invention provides that the cross-linking is carried out in the presence of oxidation inhibitors, wherein the inhibition-active --OH and/or --NH functions are at least partially substituted by protective silyl- and/or silylene groups, the inhibitor molecule containing at least one Si-alkenyl group. The method according to the invention is suitable for use with radical as well as radiation-cross-linkable polymer.

Method for cross-linking and stabilizing polymers which can be

Addition complexes of tertiary amines and boron trichloride of the general formula BCl.sub.3.NR.sub. 1 R.sub.2 R.sub. 3 are used as an accelerator system for a heat-curing reaction resin mixture of purified polyisocyanate and polyepoxy resin compounds. Insulation impregnated with this reaction resin mixture exhibits high thermal stability in the hardened condition and can be used at high operating temperatures.

Hot-hardening reaction resin mixture for impregnating the insulation of

The invention provides a method for the preparation of relief structures of highly heat-resistant polymers, using radiation-sensitive, soluble preliminary polymers in the form of polyaddition or polycondensation products of polyfunctional carbocyclic or heterocyclic compounds containing radiation-sensitive radicals in ester groups bound to said compounds with diamines, diisocyanates, bis-acid chlorides or dicarboxylic acids of cyclic structure. According to the invention, the polyfunctional compounds carrying the radiation-sensitive radicals have, besides carboxyl, carboxylic acid chloride, amino, isocyanate or hydroxyl groups suitable for addition and condensation reactions, radiation-reactive radicals in the ester-groups bound to the compounds, partly in ortho or peri position thereto of the following structure: ##STR1## wherein: R.sub.1 = alkylene or aralkylene

Method for the preparation of relief structures

The invention provides epoxy resin casting compounds based on polyepoxides, polycarboxylic acids and/or polycarboxylic acid anhydrides with directly or latently present carboxyl functions, which can be converted by polyaddition and/or polymerization into insoluble and unmeltable cross-linked polymers. According to the invention, the carboxyl functions are replaced, at least partially, by maleic acid monoallyl ester and a polymerization-initiating radical former, the maleic acid monoallyl ester component being present in the reaction mixture in free form and/or in the form of adducts to the polyepoxide. The epoxy resin casting compounds constitute systems which can be processed in a wide temperature range and are cross-linked rapidly at elevated temperature.

Cross-linkable epoxy resin casting compounds

The invention provides mixtures based on resins containing allyl groups and being solid at room temperature, useful for the preparation of thermally stable, photo-crosslinkable layers and foils. According to the invention, such mixtures comprise triallylcyanurate prepolymers and/or triallylcyanurate precopolymers with compounds containing allyloxy and/or allylester groups, and compounds with at least one N-maleimide group, wherein the C.dbd.C double bond of the N-maleimide groups are bonded to hydrogen, hydrogen and chlorine or hydrogen and methyl radicals. Preferably, the N-maleimide C.dbd.C bonds carry hydrogen.

Mixture yielding thermally stable photo-cross-linkable layers and foils

The invention provides a method for the preparation of solvent soluble, highly heat-resistant layered structures, using radiation-sensitive, soluble, preliminary polymers. According to the invention, soluble preliminary polymers are used which are prepared in a hexamethyl phosphoric acid triamide solution and which comprise polycondensation products of primary diamines with bicyclo[2.2.2.]octene-7-tetra carboxylic acid-2,3,5,6-diester-bis-acid chlorides wherein the ester groups are in the orthoposition with respect to the acid chloride groups and contain radiation-reactive radicals. Optionally di-ortho-tetracarboxylic acid-diester-bis-acid chlorides and/or di-ortho-tetracarboxylic acid-bis-anhydrides, carrying radiation-reactive ester radicals, can also be used in addition to the bicyclo[2.2.2.]octene-7-tetra carboxylic acid-2,3,5,6-diester-bis-acid chlorides.

Method for the preparation of layer structures

The invention provides a method for the preparation of relief structures of highly heat-resistant polymers, using radiation-sensitive, soluble preliminary polymers in the form of polyaddition or polycondensation products of polyfunctional carbocyclic or heterocyclic compounds containing radiation-sensitive radicals in ester groups bound to said compounds with diamines, diisocyanates, bis-acid chlorides or dicarboxylic acids of cyclic structure. According to the invention, the polyfunctional compounds containing the radiation-sensitive radicals contain, besides carboxyl, carboxylic acid chloride, amino, isocyanate or hydroxyl groups suitable for addition or condensation reactions, partly in ortho or peri-position thereto, radiation-reactive radicals in the ester groups bound to the compounds having an oxyalkylene methacrylate or acrylate structure.

Growing community of inventors

Erlangen, Germany

Wolfgang Kleeberg