Robert Boschgmbh

Wolfgang Jacob

Ulrich Drews

Walter Kohl

Rainer Topp

Lothar Gademann

Gerhard Koelle

Ralf Schmid

Christoph Ruf

Hans-Reiner Krauss

Juergen Zaremba

Harald Tschentscher

Rolf Becker

Ingo Gorille

Ulrich Trescher

Thomas Lott

Bernd Bireckoven

Quoc-Dat Nguyen

Peter Urbach

Albert-Andreas Hoebel

Stefan Kotthaus

Stephan Rees

Hans-Peter Mueller

Kuno Wolf

Alexander Wallrauch

Joerg Moessner

Holger Heinisch

Dirk Scholz

Walter Zein

Christian Breuning

Thomas Hessler

Christian Greiner

Proposed is an integrated drive element () which is particularly suitable for use in an automatic shift transmission of a motor vehicle. The integrated drive element () has at least one electric motor (), with preferably precisely two electric motors () being provided which can be used for example for a dual-clutch transmission. Also provided is at least one electronic engine control unit () which is designed for controlling the functionality of the at least one electric motor (). Said electronic engine control unit () in turn has a housing (). The at least one electric motor () spatially directly adjoins the housing () and/or is at least partially integrated into the at least one housing ().

Integrated drive element

The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips () with essentially the same structure are mounted on a surface () pertaining to a first conductor carrier () and coated with strip conductors (). Said two semiconductor chips () comprise a first surface () and a second surface (), one semiconductor chip () being mounted on the conductor carrier surface () with the first surface () thereof, and the other semiconductor chip () being mounted on the conductor carrier surface () with the second surface () thereof. The second surface () of the first semiconductor chip () and the first surface () of the other semiconductor chip () are interconnected by a lead frame () with an A.C. power supply ().

Method for producing an electronic circuit

In a system for the electrical contacting of at least one connection element of an electronic circuit in a hermetically sealed housing with a conductor element having a base plate for holding the at least one connection element, the conductor element is provided with a press-in pin which may be pressed-in in one section of the connection element to form a contact.

System for electrical contacting

A device for protecting electronic components against overvoltages of a supply voltage is provided, which device includes at least one semiconductor transistor which is switchable by a trigger circuit when a predetermined overvoltage value is reached, thereby converting electrical energy to thermal energy.

Device for protecting electronic components

To make holes in ceramic green sheets that are needed to create feedthroughs, it is proposed to make the holes by using a gas that is under a higher pressure than atmospheric pressure and that is expelled in a pulsed manner from a pressure vessel and thereby acts on a principal surface of a ceramic green sheet, at at least one location at which a hole is to be made, in such a way that material is shot out of the ceramic green sheet at that location. This eliminates the disadvantages associated with the use of punches to punch holes.

Method for making holes in ceramic green sheets

Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semiconductor component is disposed between two adjacent carrier substrates of the stack and is contacted electrically and heat-conductively to at least one conductor track of a carrier substrate disposed in the stack above the semiconductor component and to at least one further conductor track of a carrier substrate disposed in the stack below the semiconductor component. To both improve heat output and provide a compact design, the two outer carrier substrates of the stack are embodied as one upper and one lower housing wall of a closed housing part surrounding the at least one semiconductor component, and the interstices between the stacked carrier substrates are tightly closed by an encompassing wall secured to the carrier substrates.

Power semiconductor module

In order to improve heat dissipation and to reduce parasitic inductivity in an electronic semiconductor module, which has a carrier substrate having an electrically insulating layer, a metal layer in which printed conductors are formed via structuring and which is arranged on the upper side of the insulating layer, and a metal cooling body arranged on the lower side of the insulating layer, and at least one semiconductor component arranged on the carrier substrate, the electrically insulating layer has at least one notch, and at least one terminal face provided on the upper side of the semiconductor component facing away from the carrier substrate is electrically connected to a contact element which is directly connected to the metal cooling body via the notch.

Electronic semiconductor module

Device for setting the output voltage in a three-phase alternator

A module for an electronic circuit of chip or hybrid design, combined with a brush holder for generators in motor vehicles has connecting lines embedded between the electronic circuit, the carbon brushes and a plug-in terminal in a housing component made of insulating material. The circuit which is bonded or soldered to a bearing plate is surrounded, for the purpose of making contact with the contacting lines by a collar of the housing component which is closed by a lid. For good dissipation of heat and cost effective manufacture of this module, the bearing plate with the circuit is to be attached directly to the generator housing and the brush holder with its contact components for the brush terminals is also to be formed on in one piece to the housing component.

Module for controllers and brush holders and method of manfacturing it

Device for operating a gas discharge lamp

Growing community of inventors

Horb, Germany

Wolfgang Jacob