Siemens Aktiengesellschaft

Infineon Technologies Ag

Osram Opto Semiconductors Gmbh

Osram Gmbh

Osram Opto Semiconductor Gmbh

Wolfgang Gramann

Hans-Ludwig Althaus

Ralf Dietrich

Werner Spath

Georg Bogner

Werner Spaeth

Gerhard Kuhn

Martin Weigert

Werner Späth

Frank Singer

Herbert Brunner

Franz Auracher

Günter Waitl

Ewald Karl Michael Guenther

Ulrich Steegmüller

Patrick Kromotis

Wolfgang Reill

Raimund Oberschmid

Werner Kuhlmann

Mathias Kämpf

Markus Wicke

Michael Sailer

Gunther Waitl

Werner Marchl

Jürgen Dachs

Hubert Schmid

Wolfgang Teich

Alfred Rast

Wilhelm Karsten

Mathias K&auml;mpf

Sven Weber-Rabsilber

A method for encapsulating at least one organic light-emitting (OLED) device is disclosed. The method includes the step of forming a concave region on a plate by applying a negative pressure to a predetermined area of the plate. The plate is attached to a substrate including at least one active region such that the concave region of the plate spans over the active region.

Method for encapsulating at least one organic light-emitting (OLED) device and OLED device

A radiation source has a field of semiconductor chips, which are disposed below a field of micro-lenses () disposed in a hexagonal lattice structure. The radiation source is distinguished by high radiation output and radiation density.

Radiation source and method for producing a lens mould

An optical sensing head, which is for reading out an optical data memory, has a substrate with a main surface. An edge-emitting laser component is configured on the main surface of the substrate and has irradiation axis oriented essentially parallel to the first main plane. A deflection device is arranged on the main surface of the substrate and deflects the laser radiation in a direction that is essentially perpendicular to the main surface. At least one signal detector is provided for sensing the laser radiation that is reflected by the optical data memory. An optical element guides the deflected laser radiation to the optical data memory and guides reflected laser radiation to the signal detector. The optical element is connected to the substrate by at least one supporting element. The invention also includes a method for fabricating such a sensing head.

Optical sensing head and method for fabricating the sensing head

A measuring arrangement for measuring product parameters of a component in the epitaxial layer () of a wafer comprises measuring probe () on whose contact side () a recess () is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (), which is charged with a signal from a pulsed-current source, and the surface () of the wafer (). A detector () serves for detecting the light which is emitted by the component.

Method for measuring product parameters of components formed on a wafer and device for performing the method

The invention relates to an optoelectronic component with a light emitting or light receiving element ( ) and a system carrier ( ) supporting the element ( ). The element ( ) emits or receives light on a light transmitting surface ( ), an auxiliary carrier ( ) made of heat conductive material and transparent at least in some areas or at least translucent being provided. Said auxiliary carrier ( ) is connected to the system carrier ( ) and is thermally coupled to the element ( ). The invention also relates to a method for the production of such an optoelectronic component.

Optoelectronic component with thermally conductive auxiliary carrier

A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90&deg; on the rod-shaped element with the reflective coating and traverses the submount.

Method for fabricating an optical transmitting subassembly

An optical device includes a surface-mountable optical component with a base member having a recess filled with a transparent filler and a VCSEL element arranged in the recess. A receptacle is attached to the surface-mountable optical component. The receptacle is for receiving an optical fiber to optically connect the VCSEL element to the optical fiber. Accordingly, an inexpensive way of coupling a VCSEL element with an optical fiber is provided. In particular, the surface-mountable component can be produced using a high volume production so that the overall costs of the optical device are reduced, even if the receptacle is produced in lower numbers due to varying requirements in the way that the VCSEL will be coupled to an optical fiber.

Optical device

In a method for producing an optoelectronic component, a laser chip is secured to a semiconductor wafer that is provided with metal structures. Thereafter, for each laser chip, one lens-coupling optical element that deflects the beam path of the laser chip is positioned on the semiconductor wafer. The laser chip is driven, and the space between the laser chip and the lens-coupling optical element is varied and set such that a predetermined beam condition with respect to the location of the optical image plane is met.

Method for producing an optoelectronic component

An optoelectronic sensor module is provided for recognition of reflection patterns on a magnetic data carrier. A laser component having a laser radiation axis, at least a first sensor photodetector laterally displaced relative to the laser radiation axis, electrically conducting bond pads and mutually electrically insulated conducting paths, are disposed on or in a silicon submount or cooling element. A lens configuration which is provided at a side of the laser emitter component opposite the cooling element, is fixed on the cooling element by at least one supporting web.

Optoelectronic sensor module

An optoelectronic module for bidirectional optical data transmission has a molded element provided as a beam splitter, which consists essentially of a material that is transparent for the emitted radiation and the received radiation, and in which a beam splitter is embedded. A transmitting component, a receiving component and a radiation focusing device are advantageously directly connected to the molded element.

Optoelectronic module for bidirectional optical data transmission

An LED device includes at least one LED chip having a front contact metallization disposed on a light exit surface of a light-emitting member and a rear contact metallization disposed on a side of the light-emitting member opposite the light exit surface. The LED chip is disposed between first and second conductor track supports. The first conductor track support is transparent and has at least one first electric conductor contacting the front contact metallization. The second conductor track support has at least one second electric conductor contacting the rear contact metallization. The LED device has, inter alia, the special advantage of permitting the size of the LED chips to be reduced, in contrast with the chip size in conventional LED devices, thus allowing the luminous spot density to be increased.

Led device

A method is provided for producing at least one beam splitter molded part from transparent material in which a beam splitter layer is embedded. Two radiation-transparent wafers, of which one is provided with a beam splitter layer, are interconnected in such a way that the beam splitter layer lies between the two wafers. Subsequently, this wafer assembly is further processed to form individual prism ingots, for example by sawing them through into wafer strips and grinding or polishing lateral surfaces, or by profile sawing. An optoelectronic module for bidirectional optical data transmission uses the beam splitter molded part.

Method for producing a beam splitter molded part and optoelectronic

An optoelectronic transducer includes a base plate, a radiation-emitting or transmitting semiconductor component disposed on the base plate, an optical lens system aimed at the semiconductor component and a spacer joined to the base plate for the lens system. The base plate, the spacer and the lens system are formed of materials with at least similar coefficients of thermal expansion. A method for producing an optoelectronic transducer includes forming indentations in a base plate for receiving semiconductor components, while leaving a land remaining on at least one side of each of the indentations. A first plate of the size of the base plate is placed on the lands and joined to the lands by material locking. The first plate is removed between the lands producing spacers joined to the base plate. A number of the semiconductor components are inserted into the indentations in accordance with a predetermined grid pattern and are joined to the base plate to form substrates. The substrates are covered with a second plate including a number of lens systems correspopnding to number of semiconductor components, while placing the lens systems of the second plate in the same grid pattern. The second plate is adjusted relative to the substrates for aiming each of the lens systems at a respective one of the semiconductor components. The second plate is secured to the substrates.

Optoelectronic transducer formed of a semiconductor component and a lens

An optoelectronic transducer has a radiation-emitting and/or radiation-receiving body on a carrier unit. The carrier unit has a mounting surface provided with a number of terminal parts. The terminal parts are provided with electrical terminal areas defining a contacting plane. The distance of the contacting plane from the mounting surface is greater than a maximum height of the body from the mounting surface, including all optional electrical conductors and covers.

Surface mountable optoelectronic transducer and method for its production

In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.

Growing community of inventors

Wuppertal, Germany

Wolfgang Gramann