Vistec Semiconductor Systems Gmbh

Leica Microsystems Semiconductor Gmbh

Wolfgang Fricke

Klaus Rinn

Hans-Artur Boesser

Michael Heiden

Joachim Wienecke

Klaus-Dieter Adam

Slawomir Czerkas

Linda Gundal

A coordinate measuring machine is disclosed having an orientor automatically orienting a substrate associated therewith. A control and computing unit is further associated with the coordinate measuring machine, so that self-calibration may be performed on the basis of at least two different and automatically set orientations of the substrate.

Coordinate measuring machine and method for calibrating the coordinate measuring machine

A system and a method for determining positions of structures on a substrate are disclosed. The system includes at least one measurement table () movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective () and a camera for determining the positions of the structures () on the substrate (). The position of the measurement objective () and/or the measurement table () may be determined by at least one interferometer (). The system is surrounded by a housing representing a climatic chamber () provided with an active pressure regulation.

System and method for determining positions of structures on a substrate

A method for allocating correction values of the degree of bending of a substrate () relative to a coordinate system () of a coordinate measuring machine () is disclosed. The positions of the at least two reference marks () on the substrate holder () are automatically determined relative to the coordinate system () of the coordinate measuring machine () for each substrate () currently placed in the substrate holder () in the coordinate measuring machine ().

Method for determining correction values for the measured values of positions of structures on a substrate

A method for determining the focal position of at least two edges of structures () on a substrate () is disclosed. During the movement of a measurement objective () in the Z-coordinate direction, a plurality of images of the at least one structure () is acquired with at least one measurement window () of a detector. An intensity profile of the structure () is determined for each image.

Method for determining the focal position of at least two edges of structures on a substrate

A method and a measuring instrument for determining the position of an edge to be measured on a pattern on a substrate are described. A complete, nonlinear model intensity profile, which identifies the edge to be measured, of a model edge is ascertained and stored, and a desired edge position xis defined therein with subpixel accuracy. A camera image of the substrate having the edge to be measured is acquired, and a one-dimensional measured intensity profile of the edge to be measured is determined therefrom. The model intensity profile is identified in the measured intensity profile with an indication of its location xrelative to a reference point. The desired position p of the edge to be measured is determined with subpixel accuracy as p=x+x.

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Netphen, Germany

Wolfgang Fricke