Atotech Deutschland Gmbh

Schering Aktiengesellschaft

Other

Wolfgang Dahms

Udo Grieser

Olanda Grieser, Legal Representative

Christopher Grieser, Legal Representative

Heiko Brunner

Klaus-Dieter Schulz

Thomas Moritz

Michael Jonat

Gerd Senge

Horst Westphal

Heinrich Meyer

Reinhard Schneider

Philip Hartmann

Stefan Kretschmer

Akif Özkök

Rolf Schumacher

Detley Nitsche

Petra Fromme

Silke Kaftanski

Helga Meyer

Walter Meyer, Deceased

Holger Weide

Udo (deceased) Grieser

The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices I and m are present in the neutral form.

Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit

For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phenazinium compounds. The mixture contains at least one phenazinium compound selected from the group comprising compounds containing two monomeric units and compounds containing three monomeric units having the general chemical formulae &#x3c;I&#x3e; and &#x3c;II&#x3e; set forth in the patent claims and in the specification as well as further oligomeric phenazinium compounds. 

Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit

For manufacturing particularly uniform and mirror bright copper coatings that are leveled and ductile as well using a relatively high current density, halogenated or pseudohalogenated monomeric pheanzinium compounds or a purity at least 85 mole-% and having the general chemical formula (I) are utilized in which R, R, R, R, R, R, R, R, X and A have the significations denoted in the claims. The compounds are prepared by diazotizing a suited starting compound prior to halogenating or pseudohalogenating it in the presence of mineral acid, diazotization means and halide or pseudohalide, with the reaction steps being run in one single vessel.

Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds

The plating bath for the deposition of satin nickel deposits according to the present invention contains at least one quarternary ammonium compound and at least one polyether, the at least one polyether having at least one strongly hydrophobic side chain. As compared to prior art plating baths, this acid plating bath has the advantage that it enables a long period of operation or heating and cooling cycles or filtration cycles, makes it possible to perform the filtration needed for continually operating the bath without using active carbon, requires a lower concentration of nickel than prior art baths to produce the satin gloss finish and has a reduced sensitivity to wetting agents that have been dragged in.

Acid plating bath and method for the electrolytic deposition of satin nickel deposits

In order to achieve an even satin-finished nickel or nickel alloy coating an acid nickel or nickel alloy electroplating bath is proposed which contains a sulfosuccinic acid compound of the general formula I additional to at least one quaternary ammonium compound, wherein R, R=hydrogen ion, alkali ion, alkaline earth ion, ammonium ion and/or C-Chydrocarbon moiety, wherein Rand Rare identical or different with the proviso that at the most one of the groups Rand R=hydrogen ion, alkali ion and alkaline earth ion, and wherein K=hydrogen ion, alkaline ion, alkaline earth ion, ammonium ion

Satin-finished nickel or nickel alloy coating

For the uniform electrolytic deposition of copper coatings, especially on printed circuit boards, an aqueous deposition bath is used which contains as constituents at least one source of copper ions, at least one compound increasing the electrical conductivity of the deposition bath as well as at least one additive, at least one transformation product, formed from epihalohydrins, dihalohydrins or respectively 1-halogen-2,3-propanediols and polyamidoamines being contained as the additive. The polyamidoamines are formed by the condensation reaction of dicarboxylic acids with polyalkylene polyamines. When copper coatings are deposited from this bath, copper layers of uniform layer thickness can be deposited.

Water bath and method for electrolytic deposition of copper coatings

Process for the electrolytic deposition of copper layers

Process for the electrolytic deposition of metal layers

Process and apparatus for electrolytic deposition of metal layers

An aqueous acid bath for galvanic precipitation of copper is disclosed. The copper plating composition comprises at least one polymer phenazonium compound and .beta.-naphtholalkoxylate. A method for using such a bath for deposition of copper coatings is also disclosed. The resultant copper coatings are smooth and bright with substantially no fine roughness or pitting.

Acid bath for copper plating and process with the use of this combination

Acid bath for the galvanic deposition of copper, and the use of such a

Acidic nickel baths containing 1-(2-sulfoethyl)-pyridiniumbetaine

The aqueous acidic bath for electrochemical deposition of a shiny and tear-free copper coating, especially for reinforcement of conductive pathways of a printed circuit with outstanding breaking elongation, contains at least one copper salt, at least one inorganic acid and at least one alkoxylated lactam as an amide-group-containing compound. The aqueous acidic bath also includes, as necessary, a compound having a chloride ion, a sulfur-containing organic compound with a solubilizing group and another organic compound selected from a group including polyglycols defined in more detail hereinbelow in Table III.

Aqueous acidic bath for electrochemical deposition of a shiny and

In a method for an automatic control of the galvanic deposition of copper coatings in acid copper bath by measuring a maximal current density and a continual dosing of gloss additives to the bath, the maximal current density is measured by cyclically measuring an actual voltage in the bath and compensating for eventual deviations of the actual voltage from the nominal value by an automatic dosing of the additives by means of dosing devices.

Method for automatic control of galvanic deposition of copper coatings

In a method for galvanic deposition of smooth and ductile copper from acid copper baths, the metal content of the bath is kept constant by using inert anodes together with soluble anodes. The inert anodes are made of precious metal, precious metal alloys or their compounds. The ratio of the geometric surface of inert to soluble anode should amount to from 1:1 to 1:200, preferably from 1:5 to 1:20. The inert anode may be provided with additional potential, and the acid bath may contain organic thio compounds. The method is useful for building up conductor paths of printed circuits.

Method for galvanic deposition of copper

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Berlin, Germany

Wolfgang Dahms