Applied Materials, Inc.

Leybold Aktiengesellschaft

Leybold Systems Gmbh

Applied Materials Gmbh & Co Kg

Balzers Und Leybold Deutschland Holding Ag

Wolfgang Buschbeck

Stefan Bangert

Andreas Lopp

Thomas Gebele

Tobias Stolley

Eggo Sichmann

Stefan Hein

Jose Manuel Dieguez-Campo

Neil Morrison

Thomas Krug

Thomas Deppisch

Hans-Georg Lotz

Friedrich Anderle

Stefan Keller

Jörg Krempel-Hesse

Simon Lau

Florian Ries

Heike Landgraf

Michael König

Juergen Henrich

Markus Hanika

J&ouml;rg Krempel-Hesse

Michael Konig

Albert Feuerstein

Susanne Schlaefer

Karl-Albert Keim

Harald Rost

Jurgen Schroeder

Dieter Haas

Manuel Jose Dieguez-Campo

An evaporation apparatus is described, particularly for evaporating a reactive material such as lithium. The evaporation apparatus includes an evaporation crucible for evaporating a liquid material, a material conduit for supplying the liquid material to the evaporation crucible, and a valve configured to close the material conduit by solidifying a part of the liquid material in the material conduit with a cooling device. The valve may include a cooling gas supply for a cooling gas, and the cooling device may be configured to cool the liquid material with the cooling gas. Further described are a vapor deposition apparatus for coating a substrate as well as an evaporation method.

Evaporation apparatus, vapor deposition apparatus, and evaporation method

A roller for transporting a flexible substrate is described. The roller includes a first coolant supply for cooling a first part of the roller and a second coolant supply for cooling a second part and a third part of the roller. The first part is provided between the second part and the third part. Additionally, a vacuum processing apparatus including a roller and a method of cooling a roller are described.

Roller for transporting a flexible substrate, vacuum processing apparatus, and method of cooling a roller

One or more heating assemblies for a material deposition apparatus for pre-heating a substrate before entering a material deposition area and/or for post-heating the substrate after exiting the material deposition area are described.

Material deposition apparatus having at least one heating assembly and method for pre- and/or post-heating a substrate

An apparatus for transportation of a substrate carrier in a vacuum chamber is provided. The apparatus includes a first track providing a first transportation path for the substrate carrier, and a transfer device configured for contactlessly moving the substrate carrier from a first position on the first track to one or more second positions away from the first track. The one or more second positions include at least one of a position on a second track and a process position for processing of a substrate. The transfer device includes at least one first magnet device configured to provide a magnetic force acting on the substrate carrier to contactlessly move the substrate carrier from the first position to the one or more second positions.

Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber

An apparatus includes a substrate support having an outer surface for guiding the substrate through a first vacuum processing region and at least one second vacuum processing region. First and second deposition sources correspond to the first processing region and at least one second deposition source corresponds to the at least one second vacuum processing region, wherein at least the first deposition source includes an electrode having a surface that opposes the substrate support. A processing gas inlet and a processing gas outlet are arranged at opposing sides of the surface of the electrode. At least one separation gas inlet how one or more openings, wherein the one or more openings are at least provided at one of opposing sides of the electrode surface such that the processing gas inlet and/or the processing gas outlet are provided between the one or more openings and the surface of the electrode.

Common deposition platform, processing station, and method of operation thereof

A dynamic load lock chamber that includes a plurality of actuators positioned along its length to achieve a desired pressure gradient from an atmospheric pressure side to a processing pressure side of the chamber is provided. The chamber includes a transport belt continuously running through the chamber to transport substrates from the atmospheric pressure side to the processing pressure side of the chamber, if situated on an inlet side of a production line, and from the processing pressure side to the atmospheric pressure side of the chamber, if positioned on an outlet side of the production line. Separation mechanisms may be attached to the belt to separate discrete regions within the chamber into a plurality of discrete volumes. Substrates may be disposed between the separation mechanisms, such that separation between adjacent pressure regions within the chamber is maintained as the substrates are transported through the chamber.

Dynamic load lock with cellular structure for discrete substrates

The invention relates to a method for operating a magnetron sputter cathode, in particular a tube cathode or several tube cathodes forming an array. In such cathodes a target passes through a magnetic field, whereby induction currents flow in the target which distort the magnetic field. This results in the nonuniform coating of a substrate. By having the relative movement between magnetic field and target alternately reverse its direction, the effect of the magnetic field distortion can be compensated. This yields greater uniformity of the coating on a substrate to be coated.

Method for operating a sputter cathode with a target

In a sputtering device with magnetic amplification, a magnetic field is generated by means of a permanent magnet system, whose lines of force run above and penetrate the sputtering surface, whereby the permanent magnet system is formed of two dosed, coaxial circular or oval rows (,) of individual magnets (,&prime; . . . ) that are connected via a yoke (,), whereby the surface of the target (,) that faces away from the rows of permanent magnets (,) is formed of two partial surfaces (,) that form an angle to each other and whereby the edge (,) that is formed by the two partial surfaces (,) runs parallel to the two rows (,) of permanent magnets (,&prime; . . . ) and whereby an insert (,) made of ferromagnetic material is inserted between the magnetic yoke (,) and the surface of the target (,) that faces the magnetic yoke (,).

Sputtering device with a cathode with permanent magnet system

A first vacuum pump (14) is connected to a vacuum chamber (5) by a primary intake line (13) having a first vacuum valve (4) therein. A second vacuum pump (15) is connected to the output of the first vacuum pump (14) by a connecting line (20) having a second vacuum valve (12) therein. A blowout valve (17) is connected to the connecting line (20) between the first pump (14) and the second valve (12). A secondary intake line (19) having therein a third vacuum valve (13) is connected between the vacuum chamber (5) and the intake of the second vacuum pump (15).

Apparatus for the rapid evacuation of a vacuum chamber

For the evacuation of a low-vacuum chamber (4) and of a high-vacuum chamber (5), two pump trains (6, 7) are provided, each consisting of a vacuum pump unit (8, 9) and a forepump unit (10, 11). The forepump unit (11) of the pump train (7) of the high-vacuum chamber (5) can draw selectively from the vacuum pump unit (9) of the high-vacuum chamber (5) or from a high-vacuum pump unit (12) connected likewise to the high-vacuum chamber (5). The vacuum pump unit (9) can aspirate either from the highvacuum chamber (5) or from the low-vacuum chamber (4) and discharge to the forepump unit (10) of pump train (6) or to the forepump unit (11) of pump train (7).

Method for the evacuation of a low-vacuum chamber and of a HGH-vacuum

A crucible (9) of a nonmetallic material with an elongated cavity (42) to contain the material to be evaporated has on top a vapor emission slot (45) which is defined at its longitudinal edges (43, 44) by two elongated plates (40, 41) of a likewise nonmetallic material. In the cavity (42) two heating rods (46, 47) are disposed in a mirror-symmetrical relationship to a plane of symmetry (S) through the vapor emission slot (45), one under each of the plates (40, 41) defining the vapor emission slot (45). Additional heating means are provided outside of the crucible and inside of a thermal barrier system.

Linear thermal evaporator for vacuum vapor depositing apparatus

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Hanau, Germany

Wolfgang Buschbeck