Infineon Technologies Ag

Wolf Allers

Jan Otterstedt

Christian Peters

Thomas Nirschl

Michael Bollu

Mihail Jefremow

Thomas Kern

Michael Bernhard Sommer

Edvin Paparisto

Leonardo Castro

David Mueller

Dominique Savignac

Nigel Chan

Giacomo Curatolo

Robert Wiesner

Dimitri Lebedev

A memory device comprises a plurality of memory cells and a plurality of evaluation elements, wherein each evaluation element of the plurality of evaluation elements is connectable with a memory cell of the memory device. The memory device further comprises an interconnection unit configured for connecting the plurality of memory cells to a first assignment of evaluation elements in a first state and for connecting the same plurality of memory cells to a second assignment of the evaluation elements in a second state. The memory device comprises an evaluation unit configured for controlling the interconnection unit to transition from the first state to the second state. The evaluation unit is configured for evaluating the plurality of memory cells in the first state to obtain a first evaluation result, and for evaluating the plurality of memory cells in the second state to obtain a second evaluation result.

Memory devices and methods for operating the same

In an example, a multiplexer is provided. The multiplexer may include one or more first strings controlling access to source-lines of the memory, wherein a first string of the one or more first strings includes a first set of two high voltage transistors and a first plurality of low voltage transistors. The multiplexer may include one or more second strings controlling access to bit-lines of the memory, wherein a second string of the one or more second strings includes a second set of two high voltage transistors and a second plurality of low voltage transistors. A method for operating such multiplexer is provided.

Multiplexer for memory

A position of a memory cell to be accessed within a memory field of a memory device is identified. A region associated with the memory field within which the position is located is identified. A compensation parameter comprising a fixed electric step value for the region is identified. The compensation parameter may be selected from a set of compensation parameters or may be calculated based upon the position of the memory cell. The compensation parameter is applied to an action performed on a line connected to the memory cell during the access of the memory cell.

Digital address compensation for memory devices

A method and an apparatus for controlling current in an array cell is disclosed. The method includes applying a supply voltage to a first access point of a transistor, precharging a second access point of the transistor to a predetermined voltage, applying a control voltage to a third access point of the transistor, and discharging the second access point of the transistor to turn on the transistor which causes a current flow through the array cell connected to the transistor.

Method and apparatus for controlling current in an array cell

The invention relates to methods and systems for reading a memory cell and in particular, an STT MRAM. In one example, a system for reading a memory cell includes a sense path and an inverse path. A reference current is provided through the sense path and is sampled via a first sampling element in the sense path, and a cell current from the memory cell is provided through the inverse sense path and is sampled via a second sampling element in the inverse sense path. Subsequently, the memory cell is disconnected from the inverse sense path, the cell current is provided through the sense path, the reference source is disconnected from the sense path, and the reference current is provided through the inverse sense path. The output levels are then determined by the cell and reference currents working against the sampled reference and sampled cell currents.

Symmetrical differential sensing method and system for STT MRAM

The invention relates to an electronic memory system, and more specifically, to a system for providing voltage supply protection in a memory device, and a method for providing voltage supply protection in a memory device. According to an embodiment, a system for providing voltage supply protection in a memory device is provided, the system including a memory array including a plurality of memory cells arranged in a plurality of groups of memory cells, and a plurality of current limiting elements, wherein each group of memory cells is associated with at least one current limiting element.

System and method for providing voltage supply protection in a memory device

Embodiments relate to systems and methods including a step of switching between two or more erase operations and/or two or more write operations for erasing of and/or writing to least one memory cell of a nonvolatile memory enabling to select a most suitable erase and/or write operation for a particular erase and/or write operation within the memory.

Method and system for switchable erase or write operations in nonvolatile memory

The invention relates to methods and systems for reading a memory cell and in particular, an STT MRAM. In accordance with one aspect of the invention, a method for reading a memory cell includes combining a cell current from a memory cell with a reference current from a reference source to create an average current, enabling the average current to flow through a first mirror transistor in a sense path and a second mirror transistor in a reference path, storing the current mismatch on a capacitor coupled to the gates of the first mirror transistor and the second mirror transistor, disconnecting the memory cell from the reference path and disconnecting the reference source from the sense path, enabling the cell current only to flow through the sense path, and determining the output level of the memory cell.

Mismatch error reduction method and system for STT MRAM

The disclosure relates to an electronic memory system, and more specifically, to a system for adaptive bit rate programming of a memory device, and a method for adaptive bit rate programming of a memory device. According to an embodiment, a system for adaptive bit rate programming of a memory device including a plurality of memory cells is provided, wherein the memory cells are configured to be electrically programmable by application of a current supplied by a current source, the system including selection devices for selecting memory cells for programming based on availability of current from the current source.

System and method for adaptive bit rate programming of a memory device

The invention relates to methods and systems for reading a memory cell and in particular, an STT MRAM. In accordance with one aspect of the invention, a system for reading a memory cell includes a read path and a precharge path. The reference current is provided through the read path and is sampled via a sampling element in the read path. Subsequently, a current from the memory cell is provided through the same sampling element and read path. The output level is then determined by the cell current working against the sampled reference current.

Differential sensing method and system for STT MRAM

A memory includes a memory cell including a first terminal, a second terminal and a channel extending between the first terminal and the second terminal. The memory further includes an energy storage element configured to support a programming of the memory cell, the energy storage element being coupled to the first terminal, an energy supply coupled to the energy storage element, and a controller. The controller is configured to activate the energy supply and to bring the channel of the memory cell into a non-conductive state for energizing the energy storage element, and to subsequently bring the channel of the memory cell into a conductive state for programming the memory cell based on the energy stored in the energy storage element.

Memory and method for programming memory cells

One or more embodiments may be related to a method of operating a phase-change memory element, comprising: providing the phase-change memory element, the phase-change memory element having a first terminal and a second terminal; causing a first current through the memory element from the first terminal to the second terminal; and causing a second current through the memory element from the second terminal to the first terminal, wherein the causing the first current programs the memory element from a first resistance state to a second resistance state and the causing the second current programs the memory element from the first resistance state to the second resistance state.

Method of operating phase-change memory

A memory cell is provided, the memory cell including a first two-terminal memory element; a second two-terminal memory element; a controller circuit configured to program the first two-terminal memory element to one or more states and the second two-terminal memory element to one or more states, wherein a state of the first two-terminal memory element and a state of the second two-terminal memory element are interdependent; and a measuring circuit configured to measure a difference signal between a first two-terminal memory element signal associated with the state of the first two-terminal memory element and a second two-terminal memory element signal associated with the state of the second two-terminal memory element.

Memory cell, a method for forming a memory cell, and a method for operating a memory cell

Embodiments of the invention describe compact memory arrays. In one embodiment, the memory cell array includes first, second, and third gate lines disposed over a substrate, the second gate lines are disposed between the first and the third gate lines. The first, the second, and the third gate lines form adjacent gate lines of the memory cell array. The memory cell array further includes first metal lines disposed over the first gate lines, the first metal lines coupled to the first gate lines; second metal lines disposed over the second gate lines, the second metal lines coupled to the second gate lines; and third metal lines disposed over the third gate lines, the third metal lines coupled to the third gate lines. The first metal lines, the second metal lines and the third metal lines are disposed in different metallization levels.

Growing community of inventors

Munich, Germany

Wolf Allers