Koninklijke Philips Corporation N.V.

Hewlett-packard Company

Philips Image Guided Therapy Corporation

Agilent Technologies, Inc.

Koninklijke Philips Electronics N.v.

Wojtek Sudol

Francis E Gurrie

William J Ossmann

Richard Edward Davidsen

Stephen Charles Davies

Michael Scarsella

Anjali Saini

Mike Lavy

Bernard Joseph Savord

Andrew Lee Robinson

Johannes Wilhelmus Weekamp

George Anthony Brock-Fisher

Walter Patrick Kelly, Jr

Martha Wilson

Junho Song

James Christopher Taylor

Hyunggyun Lee

Ronald Dekker

Peter Dirksen

Vincent Adrianus Henneken

Rodney J Solomon

Marcus Cornelis Louwerse

Bout Marcelis

David P Dolan

Gregory G Vogel

Richard Davidsen

James T Fearnside

Alec Rooney

Kevin Grayson Wickline

Richard E Davidsen

Larry A Ladd

Samuel Raymond Peters

Paul Cartier

Yongjian Yu

Heather Beck Knowles

James Paolino

Carl Dean Herickhoff

Johannus W Weekamp

Samuel R Peters

Martha Grewe-Wilson

A system includes an intraluminal device configured to be positioned within a body lumen of a patient, the intraluminal device comprising a proximal portion and a distal portion, wherein the intraluminal device further comprises: a sensor disposed at the distal portion; a proximal connector comprising a printed circuit board assembly (PCBA) configured to interface with a user console and disposed at the proximal portion; and a plurality of electrical wires connecting the sensor and the proximal connector, wherein the plurality of electrical wires are terminated at an angle on the PCBA such that the PCBA and electrical wires terminated thereon together are configurable to form a cross-section of 2 mm2 or less.

Electrical wire connection in ultrasound imaging devices, systems, and methods

The present disclosure advantageously describes ultrasound imaging arrays that comprise ergonomic, non-rectangular shapes, as well as associated systems and methods. Non-rectangular transducer arrays allow for ergonomic probe shapes that improve patient comfort, maneuverability of the ultrasound device, and operator workflow. For example, an ultrasound imaging device can include an array of acoustic elements comprising a non-rectangular perimeter. The array includes a plurality of active elements configured to emit ultrasound energy and receive echoes corresponding to the emitted ultrasound energy, and a plurality of buffer elements surrounding the plurality of active elements at the non-rectangular perimeter of the array of acoustic elements. An edge seal comprising a sealing material is positioned at least partially around the plurality of buffer elements, and a buffer element of the plurality of buffer elements is spaced from at least one other buffer element by the sealing material of the edge seal.

Non-rectangular transducer arrays and associated devices, systems, and methods

An imaging assembly for an intraluminal device is provided. In one embodiment, the imaging assembly includes: an array of ultrasound transducer elements spaced apart by air kerfs; a plurality of buffer elements surrounding the array of ultrasound transducer elements, wherein the plurality of buffer elements are spaced apart by gaps; and a sealing material filling portions of the gaps between the plurality of buffer elements.

Transducer arrays with air kerfs for intraluminal imaging

An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.

Intra-cardiac echocardiography interposer

An intraluminal imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient. The flexible elongate member includes a plurality of coaxial cables. Each of the plurality of coaxial cables includes a conductive shield layer. The intraluminal imaging device also includes an ultrasound imaging assembly positioned at a distal portion of the flexible elongate member and in communication with the plurality of coaxial cables. The ultrasound imaging assembly includes a transducer array configured to obtain ultrasound data and a conductive pad. The conductive shield layer of each of the plurality of coaxial cables is mechanically and electrically coupled to the conductive pad. Associated devices, systems, and methods are also provided.

Electrical wire connection in intraluminal ultrasound imaging devices and system

A device for imaging within a body of a patient is provided. In one embodiment, the device includes a flexible elongate member that can be inserted into the body of the patient. The device also has an imaging assembly that is disposed at and extending a length of a distal portion of the flexible elongate member. The imaging assembly may include an array of imaging elements that may have an outward surface and an inward surface. The imaging assembly may further include an integrated circuit adjacent to the inward surface of the array of imaging elements. The device may further include a conductive plate adjacent to and extending at least a portion of a length of the imaging assembly. The conductive plate may receive heat generated by at least one of the array of imaging elements or the integrated circuit.

Ultrasound imaging device with thermally conductive plate

An integrated circuit die is disclosed that comprises a substrate defining a plurality of circuit elements; a sensor region on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells; and an interposer region on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts for contacting the integrated circuit die to a connection cable and mounting pads for mounting a passive component on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

IC die, probe and ultrasound system

An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.

Intraluminal imaging devices with a reduced number of signal channels

A device for imaging within a body of a patient is provided. In one embodiment, the device includes a flexible elongate member that can be inserted into the body of the patient. The device also has an imaging assembly that is disposed at and extending a length of a distal portion of the flexible elongate member. The imaging assembly may include an array () of imaging elements that may have an outward surface and an inward surface. The imaging assembly may further include an integrated circuit () adjacent to the inward surface of the array of imaging elements. The device may further include a conductive plate () adjacent to and extending at least a portion of a length of the imaging assembly. The conductive plate may receive heat generated by at least one of the array of imaging elements or the integrated circuit.

The invention relates to a capacitive micro-machined ultrasound transducer (CMUT) cell () comprising a cell floor () having a first electrode (); a cell membrane () having a second electrode (') which opposes the first electrode and vibrates during transmission or reception of acoustic energy; a transmitter/receiver coupled to the first and second electrodes which causes the cell membrane to vibrate at an acoustic frequency and/or receives signals at an acoustic frequency; and an acoustic lens (), overlaying the cell membrane, and having an inner surface opposing the cell membrane and an outer, patient-facing surface. According to the present invention the acoustic lens comprises at least one layer of a material selected from the group of: polybudatiene, polyether block amide (PEBAX), polydimethylsiloxane (PDMS) and buthylrubber.

Capacitive micro-machined ultrasound transducer cell

An ultrasound probe is formed with protected interconnects, thereby resulting in a more robust probe. The interconnects are mounted between an array of transducer elements and an integrated circuit. The array of transducer elements are coupled to the interconnect via flip chip bumps or other structures. Underfill material fixedly positions the interconnects to the integrated circuit. A method of making the transducer assembly is provided.

Robust ultrasound transducer probes having protected integrated circuit interconnects

An integrated circuit die () is disclosed that comprises a substrate () defining a plurality of circuit elements; a sensor region () on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (); and an interposer region () on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts () for contacting the integrated circuit die to a connection cable () and mounting pads () for mounting a passive component () on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

Growing community of inventors

Andover, MA, United States of America

Wojtek Sudol