Eastman-kodak Company

Wojciech M Przezdziecki

John C Wilson

Paul D Yacobucci

Peter Jerome Cowdery-Corvan

George L Fletcher, Jr

Diane E Kestner

Richard C Van Hanehem

Colin Holstead

Hans M Wagner

Jean Z DeRuyter

Louis J Markin

Thermally processable imaging elements in which the image is formed by imagewise heating or by imagewise exposure to light followed by uniform heating are provided with both a backing layer and an electroconductive layer to reduce static electricity effects and improve conveyance through processing equipment. The backing layer is an outermost layer and is located on the side of the support opposite to the imaging layer whereas the electroconductive layer is an inner layer and can be disposed on either side of the support.

Thermally processable imaging element comprising an electroconductive

An improved method for manufacture of a thermographic or photothermographic element comprises the addition to the imaging composition of an amount sufficient to enhance the adhesive characteristics thereof of a polyalkoxysilane which has been pre-hydrolyzed in an organic solvent with a stoichiometric amount of water. A particularly suitable material is tetraethoxysilane which has been hydrolyzed in acetone with four moles of water for each mole of tetraethoxysilane.

Method for the manufacture of a thermally processable imaging element

A thermally processable imaging element having a hydrophobic imaging layer, an adhesion promoting polymer layer and an overcoat layer comprising poly(silicic acid) provides improved adhesion of the overcoat layer during thermal processing. The adhesion promoting layer comprises a terpolymer that promotes adhesion between the hydrophobic imaging layer and the overcoat layer without adversely affecting sensitometric properties of the imaging element. The adhesion promoting layer is useful in photothermographic and thermographic elements and processes.

Thermally processable imaging element comprising an overcoat layer

In a thermally processable imaging element and process an imaging layer comprising a photothermographic or thermographic imaging composition and 2.5 to 20% by weight of the layer of at least one hydrolyzed polyalkoxysilane (hydrolyzed Si(OR.sub.1).sub.4 or hydrolyzed R.sub.2 --Si(OR.sub.3).sub.3) enables increased maximum image density. Such a hydrolyzed polyalkoxysilane in a hydrophobic imaging layer of such an element enables increased adhesion of the imaging layer to a contiguous hydrophobic hydrophilio layer, particularly a hydrophilic overcoat layer.

Thermally processable imaging element and process

A backing layer comprising a combination of poly(silicic acid) and a water soluble hydroxyl containing polymer or monomer that is compatible with poly(silicic acid) on the side of a support opposite that containing the imaging layer of a thermally processable element enables improved conveyance of the element and reduced static electricity effects during manufacturing and elimination of Newton Rings formation during duplication of the recorded images, without undesired sensitometric effects. A developed visible image is provided in an exposed silver halide photothermographic element comprising such a backing layer by uniformly heating the photothermographic element to moderately elevated temperatures. The described backing layer is also useful on thermographic elements.

Thermally processable element comprising a backing layer

A overcoat layer comprising poly(silicic acid) ##STR1## on a thermally processable element enables reduced release of volatile components from the element during thermal processing. The overcoat layer also can optionally comprise other water soluble polymers. A developed visible image is provided in an exposed silver halide photothermographic element comprising such an overcoat by uniformly heating the photothermographic element to moderately elevated temperatures without release of volatile components. The described overcoat is also useful on thermographic elements.

Thermally processable element comprising an overcoat layer containing

A 6-substituted-2,4-bis(trichloromethyl)-s-triazine stabilizer precursor which has a maximum absorption wavelength greater than 320 nanometers and is thermally stable at temperatures up to 150.degree. C. provides improved post-processing stability in a photothermographic silver halide material designed for dry physical development. Such a photothermographic material comprises photographic silver halide and an image forming combination comprising (i) an organic silver salt oxidizing agent, with (ii) a reducing agent for the organic silver salt oxidizing agent. A developed visible image is provided after imagewise exposure by uniformly heating the photothermographic material to moderately elevated temperatures.

Photothermographic material and processing comprising a substituted

An imaging composition and element are disclosed wherein an aromatic dialdehyde reacts with amines generated in response to activating radiation. Improved binders are used to insure sufficient retention of the volatile dialdehyde prior to imaging.

Imaging processes, elements and compositions featuring dye-retaining

Light-sensitive compositions including a polymer of the type that is reactable with an azide sensitizer when exposed to light and a sensitizing amount of a naphthalene sensitizer having ortho diazo and oxo substituents at the 1,2 or the 2,1 positions of the naphthalene nucleus and further having an azidosulfonyl substituent group of which the sulfonyl moiety is bonded directly to the naphthalene nucleus at the 4 or the 5-position, are advantageous in the preparation of positive-working photolithographic materials. IN the azidosulfonyl group, the azido moiety can be linked directly or indirectly to the sulfonyl moiety, such as in the compounds 2-diazo-1,2-dihydro-1-oxo-5(4'-azidophenoxysulfonyl)naphthalene and 5-azidosulfonyl-2-diazo-1,2-dihydro-1-oxonaphthalene. The light-sensitive compositions can be coated on support materials to prepare composite photographic elements having utility as photolithographic printing masters and photoresists for etching operations.

Growing community of inventors

Pittsford, NY, United States of America

Wojciech M Przezdziecki