Hitachi Global Storage Technologies Netherlands B.v.

Sandisk 3d LLC

International Business Machines Corporation

Hgst Netherlands, B.v.

Hitachi Global Storage Technologies

Wipul Jayasekara

Hardayal Singh Gill

Howard Gordon Zolla

Mustafa Pinarbasi

Ying Hong

Richard Hsiao

Marie-Claire Cyrille

James Mac Freitag

Jeffrey Scott Lille

Kuok San Ho

Wen-Chien David Hsiao

Mark Anthony Church

Vladimir Nikitin

Daniele Mauri

David John Seagle

Kim Yang Lee

Ching Hwa Tsang

Jui-lung Li

Satoru Araki

Robert Beach

Patrick Rush Webb

Michael R Feldbaum

Chu-Chen Fu

Timothy James Minvielle

Werner J Douglas

Raghuveer S Makala

Son Van Nguyen

Er-Xuan Ping

Quang Le

James K Kai

Robert Fontana

Peter Rabkin

Ming Jiang

Tsann Lin

Aron Pentek

George Samachisa

Tong Zhang

April Dawn Schricker

Franz Kreupl

Yung-Tin Chen

Sue Siyang Zhang

Douglas Johnson Werner

Hung-Chin Guthrie

Jyh-Shuey Jerry Lo

Elizabeth Ann Dobisz

Xiao Z Wu

Abhijit Bandyopadhyay

Tsung Yuan Chen

Huey-Ming Tzeng

Frederick Hayes Dill

David Eugene Heim

Huiwen Xu

Jingyan Zhang

Shawn Marie Collier Hernandez

Benjamin Lu Chen Wang

A fabrication process for a resistance-switching memory cell uses metal oxide as a resistance-switching material. A metal oxide film having an initial stoichiometry is deposited on an electrode using atomic layer deposition. A changed stoichiometry is provided for a portion of the metal oxide film using a plasma reduction process, separate from the atomic layer deposition, and another electrode is formed adjacent to the changed stoichiometry portion. The film deposition and the plasma reduction can be performed in separate chambers where conditions such as temperature are optimized. The metal oxide film may be deposited on a vertical sidewall in a vertical bit linememory device. Optionally, the mean free path of hydrogen ions during the plasma reduction process is adjusted to increase the uniformity of the vertical metal oxide film. The adjustment can involve factors such as RF power, pressure and a bias of the wafer.

Plasma reduction method for modifying metal oxide stoichiometry in ReRAM

Methods in accordance with this invention form a microelectronic structure by forming a carbon nano-tube ('CNT') layer, and forming a boron nitride layer ('BN liner') above the CNT layer, wherein the BN liner comprises: (1) a first portion disposed above and in contact with the CNT layer; and/or (2) a second portion disposed in and/or around one or more carbon nano-tubes in the CNT layer. Numerous other aspects are provided.

Electronic devices including carbon nano-tube films having boron nitride-based liners, and methods of forming the same

A memory device in a 3-D read and write memory includes memory cells. Each memory cell includes a resistance-switching memory element (RSME) in series with a steering element. The RSME has first and second resistance-switching layers on either side of a conductive intermediate layer, and first and second electrodes at either end of the RSME. The first and second resistance-switching layers can both have a bipolar or unipolar switching characteristic. In a set or reset operation of the memory cell, an ionic current flows in the resistance-switching layers, contributing to a switching mechanism. An electron flow, which does not contribute to the switching mechanism, is reduced due to scattering by the conductive intermediate layer, to avoid damage to the steering element. Particular materials and combinations of materials for the different layers of the RSME are provided.

Composition of memory cell with resistance-switching layers

Methods in accordance with this invention form a microelectronic structure by forming a carbon nano-tube ('CNT') layer, and forming a carbon layer ('carbon liner') above the CNT layer, wherein the carbon liner comprises: (1) a first portion disposed above and in contact with the CNT layer; and/or (2) a second portion disposed in and/or around one or more carbon nano-tubes in the CNT layer. Numerous other aspects are provided.

Electronic devices including carbon nano-tube films having carbon-based liners, and methods of forming the same

A current to perpendicular to plane (CPP) magnetoresistance (MR) read head using current confinement proximal to an air bearing surface (ABS) is disclosed. A CPP MR read head includes a first shield, an MR sensor formed on the first shield, and a second shield contacting the MR sensor proximal to an ABS. The CPP MR read head further includes insulating material between the MR sensor and the second shield, where the insulating material is distal to the ABS to electrically isolate the MR sensor from the second shield distal to the ABS. Sense current injected from the second shield through the MR sensor and into the first shield is confined proximal to the ABS at a location where the second shield contacts the MR sensor.

Current perpendicular to plane magnetoresistance read head design using a current confinement structure proximal to an air bearing surface

A method for manufacturing a magnetoresistive sensor having improved pinned layer stability at small track widths. The method includes providing a substrate, and depositing a plurality of sensor layers. A layer of material that is resistant to removal by chemical mechanical polishing (CMP stop layer) and an antireflective coating layer are deposited. A photoresist mask is formed on the antireflective layer, and a reactive ion etch (RIE) is performed to remove portions of the ion mill resistant mask that are not covered by the photoresist mask, the RIE being performed in a plasma chamber having a platen, the performing the RIE further comprising applying a platen power of at least 70 W. An ion milling is performed to remove a portion of the sensor layers, the ion milling being terminating before all of the sensor materials have been removed.

Method for manufacturing a magnetoresistive sensor having a novel junction structure for improved track width definition and pinned layer stability

Methods and apparatus provide a refill configuration adjacent a back-edge that defines a height of a magnetoresistive read sensor. Milling through layers of the sensor forms the back-edge and may be initially conducted at a first angle of incidence greater than a second angle of incidence. In combination, an insulating material and a polish resistant material, such as a non-magnetic metal, disposed on the insulating material fills a void created by the milling. The sensor further includes first and second magnetic shields with the layers of the sensor along with the polish resistant material and insulating material disposed between the first and second magnetic shields.

Read sensors and methods of making same with back-edge milling and refilling

A method for manufacturing a magnetoresistive sensor that decreases the stack height of the sensor. The method includes forming a sensor structure having at its top, a Ru layer and a Ta layer over the Ru layer. An annealing process is performed to set the magnetization of the pinned layer of the sensor structure. After the annealing process has been completed and the Ta layer is no longer needed, an ion milling process is performed to remove the Ta layer.

Method for manufacturing an ultra narrow gap magnetoresistive sensor

A current to perpendicular to plane (CPP) differential magnetoresistance (DMR) read head using current confinement proximal to an air bearing surface (ABS) is disclosed. The CPP DMR read head includes a first electrically conductive lead, a first MR sensor formed on the first lead, and a non-magnetic electrically conductive spacer formed on the first MR sensor proximate to the ABS. The CPP DMR read head further includes insulating material on the first MR sensor distal to the ABS. A second MR sensor is formed in contact with the conductive spacer such that the second MR sensor is in electrical contact with the first MR sensor proximate to the ABS and is electrically isolated from the first MR sensor distal to the ABS. A second electrically conductive lead is in contact with the second MR sensor. Sense current injected into the first and the second MR sensor is confined proximate to the ABS.

Current perpendicular to plane differential magnetoresistance read head design using a current confinement structure proximal to an air bearing surface

A magnetoresistive sensor having a greatly reduced read gap. The sensor has a pinned layer structure formed above the free layer. A layer of antiferromagnetic material (AFM layer) is formed over the pinned layer structure and has a front edge disposed toward, but recessed from the air bearing surface. An electrically conductive, magnetic lead is formed over the pinned layer and AFM layer such that the lead fills a space between the AFM layer and the air bearing surface. In this way, the read gap is distance between the outermost portion of the pinned layer structure and free layer. The thickness of the AFM layer and capping layer are not included in the read gap.

Current perpendicular to plane magnetoresistive sensor with reduced read gap

A differential giant magnetoresistive sensor for sensing a magnetic signal. The differential sensor has a structure configured to minimize spin torque noise. The differential magnetoresistive sensor includes first and second magnetoresistive sensor elements and a three lead structure including an inner lead sandwiched between the first and second sensor elements and first and second outer leads. each of the sensor elements includes an antiparallel coupled free layer structure with the free layer of each of the sensor elements preferably being positioned near the inner lead. The three lead structure allows sense current to be supplied to the sensor such that electrons travel first through the free layer of each sensor element and then through the pinned layer structure.

Differential current perpendicular to plane giant magnetoresistive sensor structure having improved robustness against spin torque noise

A magnetic structure, such as a pole tip, and method for forming the same includes forming a pole tip layer of magnetic material. A layer of polyimide precursor material is added above the pole tip layer and cured. A silicon-containing resist layer is added above the layer of polyimide precursor material and patterned. The resist layer is exposed to oxygen plasma for converting the resist into a glass-like material. Exposed portions of the cured polyimide precursor material are removed for exposing portions of the pole tip layer. The exposed portions of the pole tip layer are removed for forming a pole tip. Chemical mechanical polishing (CMP) can then be performed to remove any unwanted material remaining above the pole tip.

Perpendicular pole structure and method of fabricating the same

A combined manufacturable wafer and test device for measuring a tunneling-magnetoresistance property of a tunneling-magnetoresistance, sensor-layer structure. The combined manufacturable wafer and test device comprises a tunneling-magnetoresistance, sensor-layer structure disposed on a substrate. The combined manufacturable wafer and test device also comprises a plurality of partially fabricated tunneling-magnetoresistance sensors; at least one of the partially fabricated tunneling-magnetoresistance sensors is disposed at one of a plurality of first locations. The test device is disposed on the substrate at a second location different from the plurality of first locations. The test device allows measurement of the tunneling-magnetoresistance property of the tunneling-magnetoresistance, sensor-layer structure using a current-in-plane-tunneling technique.

Test device and method for measurement of tunneling magnetoresistance properties of a manufacturable wafer by the current-in-plane-tunneling technique

A current perpendicular to plane (CPP) magnetoresistive sensor having a free layer that is magnetically coupled with a magnetic shield, thereby providing the free layer with a large effective flux guide. Sensor performance is improved by virtually eliminating demagnetization fields at the back edge of the sensor. The free layer can be magnetically connected with the shield by a magnetic coupling layer or shunt structure that is disposed between the free layer and the shield behind the capping layer.

Current perpendicular to plane (CPP) magnetoresistive sensor with back flux guide

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Los Gatos, CA, United States of America

Wipul Jayasekara