Cree Gmbh

Winston T Parker

Michael John Bergmann

Matthew Donofrio

John Adam Edmond

David T Emerson

Kevin Haberern

Bradley E Williams

Kevin Shawne Schneider

Arthur Fong-Yuen Pun

Steven Scott Gilmore

Jay Thomas Norman

Van Mieczowski

Jim Wood

Daniel Cronin

Doowon Suh

Light emitting diodes include a silicon carbide substrate having first and second opposing faces, a diode region on the first face, anode and cathode contacts on the diode region opposite the silicon carbide substrate and a hybrid reflector on the silicon carbide substrate opposite the diode region. The hybrid reflector includes a transparent layer having an index of refraction that is lower than the silicon carbide substrate, and a reflective layer on the transparent layer, opposite the substrate. A die attach layer may be provided on the hybrid reflector, opposite the silicon carbide substrate. A barrier layer may be provided between the hybrid reflector and the die attach layer.

Light emitting diodes including integrated backside reflector and die attach

LED chip

A wafer of light emitting diodes (LEDs) is laser scribed to produce a laser scribing cut. Then, the wafer is cleaned, for example by wet etching, to reduce scribe damage. Then, electrical contact layers for the LEDs are formed on the wafer that has been cleaned. Alternatively, the scribing cut may be produced by multiple etches before contact formation. Related LEDs are also described.

Front end scribing of light emitting diode (LED) wafers and resulting devices

An assembly for supporting a substrate during vacuum processing operations includes a thermally conductive heat sink tray including at least one wafer pocket recessed therein, and a thermally conductive heat sink carrier in the at least one wafer pocket. The heat sink carrier includes a first surface in contact with a surface within the at least one wafer pocket and a second surface opposite the first surface. A heat sink is affixed to the second surface of the heat sink carrier.

Heat sink assembly and related methods for semiconductor vacuum processing systems

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Cary, NC, United States of America

Winston T Parker