Asm Technology Singapore Pte Ltd

Wing Kin Lam

Kui Kam Lam

Yen Hsi Tang

Wai Yuen Cheung

Chi Keung Leung

Shun Ming Fung

Yuet Cheung

The invention provides an apparatus for determining a bonding position of a die. The apparatus includes a bond head for picking up and bonding the die. The apparatus further includes a plurality of cameras positioned and configured for capturing at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. Further, the invention provides a method of determining a bonding position of a die. The method captures at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. The method further determines a bonding position of the die based on the captured images.

Apparatus and method of determining a bonding position of a die

An apparatusfor delivering semiconductor componentsto a substrateduring semiconductor package manufacturing. The apparatuscomprises a platformand a plurality of delivery modulesaffixed to the platform. Each of the plurality of delivery moduleshas a support devicefor supporting the substrate, as well as a delivery devicefor delivering the semiconductor componentsto the substrate. In particular, heights of the support devicesare mutually leveled for conveying the substratebetween the plurality of delivery modules

Apparatus for delivering semiconductor components to a substrate

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Kwai Chung, China

Wing Kin Lam