Cloud Light Technology Limited

Sae Magnetics (h.k.) Limited

Wing Keung Mark Mak

Vincent Wai Hung

Vivian Wei Ma

Yvonne Xiaoming Yu

Hau Chen Loke

Kwong Shing Tsang

Hulmut Ying Wai Sun

Hermit Ka Kit Wong

Paladin Li Peng Cai

Chih Hsun Lin

Jason Hok Hay Tang

Structures and active alignment methods thereof of a Transmitter Optical Sub-Assembly (TOSA) Structure are provided, that includes a light source sub-assembly including a light source component assembled on a light source bench; an optical sub-assembly including an optical component assembled on an optical bench; and a silicon chip including a coupler. A light emitted by the light source component is received by the coupler via the optical component along an optical path, the light source bench and the optical bench are thermally conductive to dissipate heat. The light source sub-assembly and the optical sub-assembly are actively aligned at the same time to optimize optical coupling between the light source sub-assembly and the optical sub-assembly by optimizing positions and a distance of the light source sub-assembly and the optical sub-assembly, the positions and the distance are flexibly adjusted during the active alignment process.

Transmitter optical sub-assembly structure and active alignment method thereof

The present disclosure provides an optical fiber to silicon photonics circuit (PIC) assembly method utilizing a structured fiber retaining apparatus for fiber confinement in which polymer filling volume for adhesion and refractive index matching purpose is reduced. Reduction of polymer volume result in smaller optical alignment change due to polymer material volume changes upon moisture absorption and aging, hence improving assembly reliability. In an embodiment, the assembly method and apparatus, transparent polymer material interfaces between fiber and edged coupler volume reduce more than 50% compares to conventional assembly method.

Fiber to silicon photonics assembly method with fiber retaining apparatus

An optical transceiver sub-assembly () integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals includes a housing chamber () and a top cover () to enclose elements of the optical transceiver sub-assembly () other than the housing chamber () and the top cover (), a bottom housing module () accommodating an optical micro integration (). In particular, the optical transceiver sub-assembly () is operably configured to establish an optical-electrical communication with an outside surrounding.

Compact micro bench for optical transceiver sub-assembly

An optical subassembly for non-reciprocal coupling of light from a planar optical waveguide output outside the optical subassembly to an optical fiber includes a carrier configured to support the optical subassembly, an optical fiber fixed to the optical subassembly, a focusing optical system consisting two foci with one focus coincident with the input of optical fiber, an optical isolator to transmit light unidirectionally between two foci, an input boundary provided by the carrier to align the optical subassembly with the planar optical waveguide output. In particular, the optical subassembly is operably configured to provide a low transmission loss for light traveling from the planar optical waveguide output to the optical fiber.

Optical subassembly for non-reciprocal coupling of light and assembly process thereof

A transmitter optical sub-assembly (TOSA) structure having an independent upward heat dissipation path for dissipating heat in an upward direction including an independent signal source, an LDU assembly including a laser diode emitting a plurality of optical signals, a cascade LDU holding the laser diode, a lens positioned in front of the laser diode on the cascade LDU and an optical bench assembly including an optical bench assembled on a photonic integrated circuit having a plurality of passive optical components assembled on the optical bench. In particular, the independent signal source, the laser diode and the cascade LDU, are independent from the plurality of passive optical components on the photonic integrated circuit.

Transmitter optical sub-assembly (TOSA) structure and an active alignment method thereof

A method and a system for active alignment of a light source assembly along three dimensions in an optical bench plane are provided. The light source assembly, preferably a laser diode on its sub-mount, is actively aligned in three dimensions, longitudinal, transection and vertical along the optical bench. The light source assembly is attached on edge of the optical bench, via adhesion processes, such as solder welding. Optical components such as collimator lens, isolator, etc are first passively aligned on the optical bench using alignment marks and epoxy slots provided on the surface of the optical bench. Then, laser diode, mounted on a laser diode sub-mount, is aligned in X and Z direction. Thereafter, the light source assembly is pushed towards the edge of the optical bench and attached with the edge via a solder joint. Also, a compensator can be actively aligned until the optimum light intensity achieved.

Laser diode edge assembly structure for three-dimensional active alignment in transmitter optical assembly

A two-part optical coupling subassembly includes a main lens formed with a cavity, the main lens including two surfaces formed in the cavity and oppositely inclined at an off-vertical angle from a central vertical plane of the cavity such that the two surfaces are symmetric with respect to the central vertical plane; a beam router embedded in the cavity, the beam router including first and second beam router surfaces lying on the two surfaces of the main lens respectively, and a partially reflective coating on at least one of the beam router surfaces; and a transparent adhesive provided between the two lens surfaces and the first and second beam router surfaces.

Growing community of inventors

Hong Kong, China

Wing Keung Mark Mak