Utac Headquarters Pte. Ltd.

Wing Keung Lam

Saravuth Sirinorakul

Hua Hong Tan

Roel Adeva Robles

Kok Chuen Lock

Wei Ming Xian

Yao Hong Wu

Tao Hu

Zong Xiang Cai

A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.

System and method of cleaning and inspecting semiconductor die carrier

An embodiment related to a stacked package is disclosed. The stacked package includes a conductive gang with gang legs electrically coupling a second component stacked over a first die to a package substrate. The first die is mounted over a die attach region of the package substrate and electrically coupled to the package substrate.

Stacked dies electrically connected to a package substrate by lead terminals

Growing community of inventors

Dongguan, China

Wing Keung Lam