A-sat Corporation

Utac Hong Kong Limited

Wing Keung Lam

Ming Wang Sze

Neil McLellan

Kwok Cheung Tsang

Chun Ho Fan

Mohan Kirloskar

Sadak Thamby Labeeb

Wai Kit Tam

Kin-wai Wong

Neil Robert McLellan

An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.

Ball grid array package with improved thermal characteristics

A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded to ones of conductive traces of the substrate. A collapsible spacer is mounted to the substrate and the substrate is releasably clamped to an upper side of a mold cavity. A heat spreader and at least one collapsible spacer are placed in the mold cavity such that the collapsible spacer is disposed between the heat spreader and the substrate. A molding compound is molded in the mold, thereby molding the semiconductor die, the substrate, the wire bonds, the die adapter, the at least one collapsible spacer and the heat spreader into the molding compound to provide a molded package. A ball grid array is formed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces and the integrated circuit package is singulated.

Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader

Ball grid array package and process for manufacturing same

An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. A semiconductor die is mounted on the first surface of the substrate and an adapter disposed on the semiconductor die. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate, and an encapsulant encapsulates the wirebonds and a remainder of the semiconductor die. A heat spreader has a top portion in contact with the adapter and at least one sidewall extends from the top portion. At least a portion of the at least one sidewall is in contact with the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.

An integrated circuit package including a flexible circuit tape having a flexible polyimide tape laminated to a conductor layer, a plurality of blind holes extending through the flexible tape to the conductor layer and a plurality of through holes extending through the flexible tape and the conductor layer. A copper leadframe is fixed to the flexible circuit tape and electrically isolated from the conductor layer. The copper leadframe includes an etched down die attach pad and heat spreader portions. The die attach pad is etched down such that at least a portion of the die attach pad is reduced in thickness. The through holes in the flexible circuit tape extend through to the copper leadframe. A semiconductor die is mounted on the at least a portion of the die attach pad. Wire bonds extend from pads on the semiconductor die to the die attach pad and from other pads on the semiconductor die to the conductor layer, an encapsulating material encapsulates the semiconductor die and the wire bonds. A plurality of solder ball contacts in the through holes are fixed to the copper leadframe and a plurality of solder ball contacts in the blind holes are fixed to the conductor layer.

Die-up tape ball grid array package

Growing community of inventors

Kowloon, China

Wing Keung Lam