Asm Assembly Automation Limited

Asm Technology Singapore Pte Ltd

Wing Hong Leung

Jiangwen Deng

Fan Wang

Chi Shing Wong

Shun Ming Kenneth Fung

Po Lam Au

Zhuanyun Zhang

Fan Leuk Lai

Siu Wing Lau

Jiang Wen Deng

Ran Shi Wang

Kwok Kee Chung

Man Lai Chau

Jun Cheng

Y Edmund Lam

Yuet Wu

Xiao Hui Cheng

Ka Fai Fung

Chi Leung Vincent Mok

Chi Kit Ronald Chung

For aligning an image sensor relative to a lens module prior to fixing the image sensor to the lens module, an exposure of the image sensor is turned on and the image sensor is moved to different distances relative to the lens module. At certain predetermined distances between the image sensor and the lens module, a calibration pattern is illuminated and two or more pictures of the calibration pattern which is focused through the lens module are captured with the image sensor to produce at least two pictures of the calibration pattern captured at different distances, the at least two pictures being superimposed onto a calibration image. The exposure of the image sensor is then turned off and the pictures of the calibration pattern are analyzed for determining an alignment between the lens module and the image sensor.

Active lens alignment system

There is provided an apparatus for alignment of a thin-film transistor (TFT) panel and a barrier panel of a three-dimensional (3D) display. The apparatus comprises at least one light source for illuminating pixels in at least one region of the TFT panel and for illuminating at least one region of an exposure pattern of the barrier panel; a pattern recognition system for detecting light emitted from the at least one light source that is reflected by or transmitted through the 3D display, to generate alignment data relating to an alignment between the detected illuminated pixels of the TFT panel and the exposure pattern of the barrier panel; and a positioning mechanism for adjusting the relative position between the barrier panel and the TFT panel in relation to the alignment data. The at least one light source comprises at least one invisible light source which emits invisible light outside the visible region of the electromagnetic spectrum.

3D display alignment method

A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.

Die bonding process incorporating infrared vision system

An apparatus for measuring a height of an object plane or multiple points on an object is disclosed. The apparatus comprises an imaging system having a focal plane passing through a focal point of the imaging system, wherein the focal plane of the imaging system is tilted at an oblique angle with respect to the object plane such that only a small portion of the object is in focus. Alternatively, the focal plane is tilted at an oblique angle with respect to a scanning direction of the imaging system during relative movement between the imaging system and the object.

Apparatus and method for inspecting an object with increased depth of field

An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.

Vision system for positioning a bonding tool

A system for three-dimensional reconstruction of a surface profile of a surface of an object is provided that utilizes a binary pattern projected onto the surface of the object. A binary string consisting of a series of '1's and '0's is first created, and a binary pattern of light that is constructed in accordance with the binary string such that bright and dark bands of light of equal widths correspond to &#x201c;1&#x201d;s and &#x201c;0&#x201d;s from the binary string respectively is projected onto the surface. The binary pattern is shifted with respect to the surface multiple times, during which an image of the binary pattern illuminating the surface is obtained at each position of the binary pattern. Thereafter, a height of each predetermined point on the surface is calculated relative to a reference plane based upon the images cumulatively obtained at said predetermined point.

Imaging system for three-dimensional reconstruction of surface profiles

The invention provides a method and an apparatus for determining a height of a point on a wire loop. A height gauge device is positioned over the point on the wire loop to be measured. Incident light is projected from the height gauge device for illuminating the point. The height gauge device receives reflected light produced from the incident light and a processor coupled to the height gauge device determines from a characteristic of the reflected light the height of the said point relative to a reference surface. Further methods and apparatus for finding a position and height of a highest point on the wire loop are also provided.

Wire loop height measurement apparatus and method

An indication of whether or not a target object is present at a site of a collet assembly is derived by monitoring light reflected from the site. The use of reflected light enables the presence of objects to be detected, especially transparent objects. In a preferred arrangement for determining if a sapphire die is present in a die-handling collet assembly, light from a source is collimated or focused into a narrow beam and directed through a beam splitter at the target site of the collet assembly. Light reflected from the surface of the die is further reflected by the beam splitter toward a photo-sensor. The reflected light is measured when the collet passes over a dark background while on the way to deliver a die at a bonding position and again while returning after attempting to place the die at the bonding position. A determination of a die present in the former and absent in the latter is indicative of a well-placed die at the bonding position.

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Hong Kong, China

Wing Hong Leung