Leica Microsystems Jena Gmbh

Winfried Deutscher

Joachim Wienecke

Karsten Urban

The invention relates to a holding device for wafers in an arrangement for wafer inspection, comprising two grippers (), each of which, in the closed state of the holding device (), encloses a subsection of the wafer circumference and which are connected to a drive device () and, when the latter is driven, the grippers () move away from each other for the purpose of opening the holding device () and move toward each other for the purpose of closing the holding device (), and a holding arm (), on which the two grippers () are pivotably mounted. In this case the holding arm () is mounted such that it can rotate about an axis (A) which lies substantially in the plane covered by the wafer (W), so that after a rotation through 180&#xb0; about the axis (A), a wafer (W) held between the grippers () has been turned.

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Jena, Germany

Winfried Deutscher