Taiwan Semiconductor Manufacturing Comp. Ltd.

Macronix International Co., Ltd.

Tsinghua University

Lite-on Technology Corporation

Lite-on Electronics (guangzhou) Limited

Win-San Khwa

Meng-Fan Chang

Jui-Jen Wu

Jen-Chieh Liu

Yi-Lun Lu

Chao-I Wu

Jin Cai

Yu-Sheng Chen

Tzu-Hsiang Su

Yen-Cheng Chiu

Yu-Der Chih

Yi-Chun Shih

Tung-Ying Lee

Hsiang-Pang Li

Jau-Yi Wu

Chien-Yin Liu

Kerem Akarvardar

Xinyu Bao

Ku-Feng Lin

Elia Ambrosi

Jia-Jing Chen

Je-Min Hung

Jui Jen Wu

Tung Ying Lee

Ming-Hsiu Lee

Shao-Ming Yu

Hiroki Noguchi

Yu-Chao Lin

Yu-Ming Chang

Jen-Chien Fu

Chien-Hsing Lee

Hon-Sum Philip Wong

Ping-Chun Wu

Rawan Naous

Tai-Hao Wen

Shuai-Fan Chen

Hsiang-Pan Li

A memory system and operating method for controlling the same are provided. The memory system includes a memory array and a control circuit. The memory array comprising a first memory block and a second memory block, wherein the first memory block has a longer endurance than the second memory block. The control circuit is configured to receive a neural network model having a plurality of weight data; divide each of the plurality of weight data into a first data segment and a second data segment, wherein the first data segment has a higher bit order than the second data segment; and program the plurality of first data segments on the first memory block and program the plurality of second data segments on the second memory block.

Memory system and operating method of the same

Memory circuits that read the bit state of memory cells are disclosed. In some embodiments, a memory circuit, includes a memory cell configured to store a bit. A reference line is configured to receive a reference signal and a data line is configured to receive a data signal. The data line is configured to be selectively coupled to the memory cell. A charge voltage select unit is configured to charge the reference line and the data line in response to a select signal being in a first select state and discharge the reference line and the data line in response to the select signal being in a second select state. A sense amplifier is configured to compare the data signal and the reference signal to sense a bit state of the bit stored by the memory cell.

Systems and methods for reading bit state in arrays of memory cells

A memory device includes a current source and a memory array. The current source is configured to provide a current to a first node. The memory array is coupled to the current source at the first node. The memory array includes memory cells. First terminals of the memory cells are coupled to the first node. Each of the memory cells has a first resistance in response to having a first data value, and has a second resistance in response to having a second data value. The second data value is N times the first data value. The second resistance is approximately one-Nth of the first resistance, for N being a positive integer larger than one. A method of operating a memory device is also disclosed herein.

Memory device and operating method thereof

A control circuit, a memory system and a control method are provided. The control circuit is configured to control a plurality of memory cells of a memory array. The control circuit comprises a program controller. The program is configured to program a first electrical characteristic distribution and a second electrical characteristic distribution of the memory cells according to error tolerance of a first bit of a data type. A first overlapping area between the first electrical characteristic distribution and the second electrical characteristic distribution is smaller than a first predetermined value.

Control circuit, memory system and control method

A memory test circuit is provided. The memory test circuit is disposed in a memory chip and electrically coupled to a memory macro of the memory chip. A high speed clock receives an input signal and an external clock signal. The input signal includes a plurality of test bits. A finite state machine controller provides a pattern type. A pattern generator generates and provides a test signal to at least one memory cell of the memory chip to write the test signal to the at least one memory cell based on the pattern type and the external clock signal. A test frequency of the test signal is determined based on the high speed clock. An output comparator outputs a comparison signal based on a difference between the test signal and a readout signal corresponding to the test signal read from the at least one memory cell.

Memory test circuit, memory chip, and testing method of memory chip

The disclosure introduces a shift register is configured to enter a low power mode by disabling a portion of flip-flops (FFs) that handles upper bits of input data. The shift register includes first FF(s), second FF(s) and gating circuit. The first flip-flop (FF), includes input terminal coupled to first portion of input data. The second FF includes input terminal coupled to second portion of input data, an output terminal, a clock terminal coupled to a clock signal, a power terminal coupled to a supply power. The second portion of the input data is subsequent to the first portion of the input data. The gating circuit is coupled to the output terminal of the first FF, and configured to disable the second FF for storing the second portion of a subsequent input data according to output data currently being stored in the first FF.

Shift register having low power mode

A circuit includes first and second data lines, a sense amplifier including first and second input terminals, a first p-type metal-oxide-semiconductor (PMOS) transistor coupled in series with a first capacitive device between the first data line and the second input terminal, a second PMOS transistor coupled in series with a second capacitive device between the second data line and the first input terminal, a third PMOS transistor coupled between the first data line and the first input terminal, a fourth PMOS transistor coupled between the second data line and the second input terminal, a first n-type metal-oxide-semiconductor (NMOS) transistor configured to selectively couple each of the first PMOS transistor and the first capacitive device to a ground node, and a second NMOS transistor configured to selectively couple each of the second PMOS transistor and the second capacitive device to the ground node.

Sense amplifier circuit and method

A circuit includes a sense amplifier, a first clamping circuit, a second clamping circuit, and a feedback circuit. The first clamping circuit includes first clamping branches coupled in parallel between the sense amplifier and a memory array. The second clamping circuit includes second clamping branches coupled in parallel between the sense amplifier and a reference array. The feedback circuit is configured to selectively enable or disable one or more of the first clamping branches or one or more of the second clamping branches in response to an output data outputted by the sense amplifier.

Memory devices, circuits and methods of adjusting a sensing current for the memory device

An integrated circuit includes a memory storage having bit cells, a write path switch configured to have a connection state determined by a reliability indicator, and a write driver having an input configured to receive an input data from a write terminal through either a first write path or a second write path. The input data received through the first write path is configured to be equal to the data at the write terminal, and the input data received through the second write path is configured to be a bitwise complement of the data at the write terminal. The reliability indicator is configured to be set based on a majority bit value in the data or based on a minority bit value in the data.

Non-volatile memory stored with encoded data

A memory device and a semiconductor die are provided. The memory device includes single-level-cells (SLCs) and multi-level-cells (MLCs). Each of the SLCs and the MLCs includes: a phase change layer; and a first electrode, in contact with the phase change layer, and configured to provide joule heat to the phase change layer during a programming operation. The first electrode in each of the MLCs is greater in footprint area as compared to the first electrode in each of the SLCs.

Memory device and semiconductor die having the memory device

The disclosure provides a method for controlling a sense amplifier. The control device includes a latch circuit and a control circuit. The latch circuit receives a plurality of memory data signals from the sense amplifier, wherein the latch circuit respectively generates a plurality of reference data signals based on the plurality of memory data signals. The control circuit is coupled to the latch circuit, provides an enable signal to the sense amplifier in response to a pass gate signal of the sense amplifier, and stops providing the enable signal in response to at least one of the plurality of reference data signals, wherein the enable signal controls a sensing period of the sense amplifier.

Method for controlling sense amplifier and control device using the same

The sense amplifier circuit includes a differential amplifier, a first switch, and a second switch. The differential amplifier includes a first input node, a second input node, a first output node, and a second output node. The differential amplifier amplifies a voltage difference of the first output node and the second output node according to a first input voltage of the first input node and a second input voltage of the second input node. A control node of the first (second) switch is coupled to a control line, the first (second) switch is coupled to the first (second) input node, and the first (second) switch is coupled to the first (second) output node. The first (second) switch pre-charges the first (second) input node by a first (second) output voltage of the first (second) output node while the control line is received a select signal.

Sense amplifier circuit, memory circuit, and sensing method thereof

Memory systems and operating method of a memory system are provided. The memory system utilized for performing a computing-in-memory (CiM) operation comprises a memory array and a processing circuit. The memory array comprises a plurality of memory cells. The processing circuit is coupled to the memory array and comprises a programming circuit and a control circuit. The programming circuit is coupled to the memory array and configured to perform a write operation for programming electrical characteristics of the memory cells. The control circuit is coupled to the programming circuit and configured to: receive a plurality of weight data corresponding to a plurality of weight values; and control the write operation performed by the programming circuit, so the electrical characteristics of the memory cells are programmed following a sequential order of the weight values.

Memory system and operating method of memory system

Disclosed is a methods and apparatus which can improve defect tolerability of a hardware-based neural network. In one embodiment, a method for performing a calculation of values on first neurons of a first layer in a neural network, includes: receiving a first pattern of a memory cell array; determining a second pattern of the memory cell array according to a third pattern; determining at least one pair of columns of the memory cell array according to the first pattern and the second pattern; switching input data of two columns of each of the at least one pair of columns of the memory cell array; and switching output data of the two columns in each of the at least one pair of columns of the memory cell array so as to determine the values on the first neurons of the first layer.

Method and apparatus for defect-tolerant memory-based artificial neural network

A memory test circuit is provided. The memory test circuit is disposed in a memory array and including: a test array, including test cells out of memory cells of the memory array; a write multiplexer, configured to selectively output one of a test signal and a reference voltage based on a write measurement signal, wherein the test signal is output to write into at least one test cell and the reference voltage is output to a sense amplifier; and a read multiplexer, configured to selectively receive and output one of a readout signal corresponding to the test signal and an amplified signal based on a read measurement signal, wherein the readout signal is read from the at least one test cell and the amplified signal is obtained for a read margin evaluation from the sense amplifier by amplifying a voltage difference between the readout signal and the reference voltage.

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Taipei, Taiwan

Win-San Khwa