Other

Wacker Siltronic Gesellschaft F{dot Over (u)}r Halbleitermaterialien Ag

Willibald Bernwinkler

Guido Wenski

Thomas Altmann

Gerhard Heier

Wolfgang Winkler

Ernst Feuchtinger

A semiconductor wafer has a front surface and a back surface and flatness values based on partial areas of a surface grid on the front surface of the semiconductor wafer, which has a maximum local flatness value SFQR of less than or equal to 0.13 &mgr;m and individual SFQR values which in a peripheral area of the semiconductor wafer do not differ significantly from those in a central area of the semiconductor wafer. There is also a process for producing this semiconductor wafer, wherein the starting thickness of the semiconductor wafer is 20 to 200 &mgr;m greater than the thickness of the carrier and the semiconductor wafer is polished until the end thickness of the semiconductor wafer is 2 to 20 &mgr;m greater than the thickness of the carrier.

Growing community of inventors

Munich, Georgia

Willibald Bernwinkler