Microelectronics and Computer Technology Corporation

William Weigler

Lawrence N Smith

Gregory E Pitts

A multilayered electrical interconnect circuit whereby interconnect lines, placed in channel regions throughout a rerouting substrate, function to reroute densely packaged electrical components via geometrically uniform spot links placed upon only the surface layer within each channel region. The interconnect circuit has closely spaced parallel X-and Y-lines orthogonal to one another, each X- and Y-line placed within horizontal and vertical channel regions, respectively, such that electrical connections between closely spaced large-scale integrated circuits or discrete electrical components can be rerouted with a combination of one or more X- and/or Y-lines.

Reroute strategy for high density substrates

A customizable interconnect circuit wherein a universal substrate of minimum layers is completely customized by programmable conductive links placed only on the top layer of the substrate. The customizable circuit having high density of orthogonally placed X- and Y-conductors capable of interconnecting closely spaced large-scale integrated circuits or discrete electrical components. By utilizing a plurality of interconnect cells regularly spaced throughout a universal, fixed substrate, interconnect routing from overlying electrical components or integrated circuits can be more directly routed to target areas.

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Austin, TX, United States of America

William Weigler