The Whitaker Corporation

William W Drabenstadt

Soren Grinderslev

Robert D Irlbeck

Richard C Fowler

Randy Marshall Manning

Fiber array connectors of the type having a connector body and adapted to house a plurality of fibers which carry data through the connector. Ferrules are provided to the connectors which are formed by first ferrule members having configured thereon by an electrical discharge machining process at least one guide pin hole, and a plurality of grooves for housing a plurality of fibers in registration in the ferrules. The ferrules are also made up of second ferrule members in engagement with the plurality of grooves for clamping the plurality of fibers in registration in the grooves so that the plurality of fibers can be held in precise alignment with the connector and so that data is transmitted therethrough with a minimum possibility of transmission error.

High density fiber ferrules and connectors

The invention relates to testing apparatus, such as the type known as a burn-in test socket for integrated circuit 'chips', where the chips are essentially planar electronic devices having a plurality of chip leads or traces, laterally projecting therefrom, for electrical interconnection to complementary traces on a planar electronic device, such as a mother board, upon which the socket may be mounted, during testing. The socket comprises a frame member for mounting to the planar electronic device, where the frame member includes electrical means for engaging chip leads and applying electrical current thereto during testing. A second element of the socket is a two-piece, adjustable cover member consisting of first and second members floatably mounted together by plural compression springs, where the first and second members are axially movable relative to one another. Specifically, the first member includes a force generating surface to apply a uniform force on the chip leads in contact with said complementary traces, while the second member, overlying the first member, includes at least a pair of latching members adapted to secure the cover member to the frame member during chip testing.

Chip socket testing apparatus with adjustable contact force

This invention is directed to a system for precisely aligning a pair of electronic devices, such as an integrated chip test socket electrically interconnected to a motherboard, where such devices are arranged in a parallel relationship. The system includes a method which comprises the steps of fixedly securing plural projections on a planar surface of each of the devices, where each projection includes a flat side or edge and that the flat side of at least two adjacent projections define a first plane or reference line. Arranging the respective planar surfaces in close proximity to one another whereby the projections from one surface contacts the other planar surface. Thereafter, shifting the respective devices relative to one another until the respective first planes or reference lines are aligned into a common plane or line. Finally the devices are fixedly secured together, whereby the electrical interconnections between the devices are precisely aligned.

Growing community of inventors

Camp Hill, PA, United States of America

William W Drabenstadt