Rockley Photonics Limited

Celestial Ai Inc.

William Vis

Chia-Te Chou

Hooman Abediasl

Cristian Stagarescu

Shuhe Li

Haydn Frederick Jones

Amit Singh Nagra

Yi Zhang

Alexander Gondarenko

Albert Benzoni

Alexander Fast

Michael Lee

David Mccann

Melissa Ziebell

A system and method for alignment. In some embodiments, the method includes measuring a first offset, the first offset being an offset along a first direction between a first alignment mark and a second alignment mark, the first alignment mark being an alignment mark on a first edge of a source die, the second alignment mark being an alignment mark on a target wafer, and the first direction being substantially parallel to the first edge of the source die.

System and method for measuring alignment

An optical assembly () for use in a wearable device is provided, the assembly () comprising: a prism (), a photonic integrated chip, PIC (), a substrate layer (), and a lid (); wherein the PIC () is mounted onto the substrate layer (); the prism () comprising: (i) a first input/output surface () optically coupled to the PIC (), and (ii) a second input/output surface () optically coupled to the lid (), the second input/output surface () orientated perpendicularly to the first input/output surface (), and wherein the prism () provides an optical path and reflects a percentage of light from the first input/output surface () to the second input/output surface (). Methods of manufacturing such an optical assembly are also provided.

Optical assemblies comprising a prism

An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.

Optoelectronic device and method of manufacture thereof

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Pasadena, CA, United States of America

William Vis