Tesla, Inc.

Tesla Motors, Inc.

Sun Microsystems, Inc.

William Thomas Chi

Nicholas Robert Kalayjian

Joshua Willard Ferguson

Michael Raj Kubba

Ryan Carter Kroeze

Benjamin David Dettmann

Mehmet Ozbek

Satish Thuta

Thomas Yu

James Britton

Jennifer D Pollock

Don Chiu

Gregory Jones

A device includes an integrated circuit (IC) die, a top-side base plate to which the IC die is mounted, and a body attached to the top-side base plate such that the IC die is inside the body, the body configured for attachment to a printed circuit board (PCB) such that the top-side base plate faces away from the PCB. The device may or may not include legs that abut the PCB upon installation.

Device with top-side base plate

A coil former, also referred to herein as a bobbin, is provided for use in conduction-cooled magnetic components that contain an air gap. The diameter of the disclosed bobbin is increased and ribs/splines or tabs are created to keep the winding centered about the core center post while allowing thermally conductive silicone-based or equivalent encapsulant to fill the voids between the coil former and the core, the coil former and the windings and/or both depending on the placement of the locating tabs. The disclosed bobbin may be fabricated from traditional injection molding resins or from high-thermal conductivity resins. As a result of the disclosed bobbin designs, the achievable power density is increased while maintaining acceptable temperatures.

Bobbin design for conduction-cooled, gapped, high-permeability magnetic components

The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.

Power electronics interconnection for electric motor drives

A server housing assembly includes a main chassis and a bezel assembly. The main chassis preferably has a 1U form factor. The bezel assembly includes a bezel chassis slidably received by the main chassis such that the bezel assembly is slidable between an inward position and an outward position with respect to the main chassis. The bezel assembly includes a bezel pivotally coupled to the bezel chassis to be pivotable between an upper position and a lower position with respect to the main chassis. The main chassis includes main electronic components, and the bezel assembly includes bezel electronic components electrically coupled or coupleable to the main electronic components. The bezel assembly is operatively associated with the main chassis such that the bezel electronic components remain electrically coupled to the main electronic components through all positions of the bezel assembly or the bezel. The bezel assembly is slidable outwardly and pivotable to allow access to information storage devices such as hard disk drives of a server while the bezel remains active. An electrically and remotely controlled locking mechanism is provided to lock the bezel assembly in the inward position.

Server bezel

Growing community of inventors

Mountain View, CA, United States of America

William Thomas Chi