International Business Machines Corporation

William Thomas Bandy, Iv

Wayne Alan McKinley

Dylan J Boday

Icko E T Iben

Icko E Tim Iben

Peter John Golcher

Larry LeeRoy Tretter

George G Zamora

Ho-Yiu Lam

Sassan K Shahidi

Icko Eric Timothy Iben

Joyce L S Tang

John Bradley Kriehn

Jeffrey Serrell Snyder

A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.

Electrostatic discharge (ESD) protection for electronic devices using wire-bonding

In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 M&#x3a9;. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.

Low viscosity electrostatic discharge (ESD) dissipating adhesive

An electrostatically dissipative adhesive in one embodiment includes a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. An electrostatically dissipative adhesive in another embodiment includes a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture, wherein the mixture has at least 50% of a lap shear strength as measured in accordance with ISO 4587 after curing for 72 hours at 22&#xb0; C. as the raw adhesive material has as measured in accordance with ISO 4587 after curing for 72 hours at 22&#xb0; C.

Electrostatic dissipative adhesive

A system in one embodiment includes a substrate; a thin film structure coupled to the substrate, the thin film structure comprising at least one of read transducers and write transducers; a closure; and an electrostatically dissipative adhesive coupling the closure to at least one of the thin film structure and the substrate. The adhesive comprises a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. The closure defines at least a portion of a tape bearing surface. Additional systems and methods are also presented.

Systems having components coupled with electrostatic dissipative adhesive

A cable having an electrostatic discharge (ESD) dissipative coating. The cable includes a lead and an ESD dissipative coating operatively coupled to the lead. Other layers such as adhesives and insulating layers can be provided. The ESD dissipative coating can also function as the insulator for the lead.

ESD dissipative coating on cables

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Fremont, CA, United States of America

William Thomas Bandy, Iv