Delsper, LP

William Steven Collins

Andrew Francis Nordquist

William Franklin Burgoyne, Jr

Mark David Conner

A polymeric composition comprising a first polymer chosen from a poly(arylene ether) polymer including polymer repeat units of the following structure: &#x2014;(O&#x2014;Ar&#x2014;O&#x2014;Ar&#x2014;O&#x2014;)&#x2014;(&#x2014;O&#x2014;Ar&#x2014;O&#x2014;Ar&#x2014;O)n- where Ar, Ar, Ar, and Arare identical or different aryl radicals, m is 0 to 1, n is 1 m; a polysulfone, a polyimide, a poly(etherketone), a polyurea, a polyurethane, and combinations thereof and a second polymer comprising a per(phenylethynyl) arene polymer derivative. Cured films containing the polymer can exhibit at least one of the following properties: Tg from 160&#xb0; C. to 180&#xb0; C., a dielectric constant below 2.7 with frequency independence, and a maximum moisture absorption of less than 0.17 wt %. Accordingly, the polymer is especially useful, for example, in interlayer dielectrics and in die-attach adhesives.

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Macungie, PA, United States of America

William Steven Collins