Agilent Technologies, Inc.

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies General IP Pte, Ltd.

William Scott Burton

Brian C Miller

Nurwati Suwendi Devnani

Jason Todd Gentry

Richard Alan Krzyzkowski

Sari K Christensen

Minh Van Quach

T Shannon Sawyer

M Jason Welch

A computer system performs a verification process that quickly and efficiently determines a temperature rise of DC conductor lines of an IC design caused by Joule heating in nearby AC conductor lines of the IC design, and whether the temperature rise is acceptable in terms of an electromigration performance of the IC design.

Computer system and method for determining a temperature rise in direct current (DC) lines caused by joule heating of nearby alternating current (AC) lines

A method for manufacturing a layered structure for routing electrical signals comprising the steps of providing a layout for the layered structure having an insulating layer with at least one signal trace, a via, and a stub trace on a first side of the insulating layer, and a generally planar electrically conductive layer disposed on a second side of the insulating layer. Identify the stub trace and define a beneficial portion on the second side based upon a layout of the stub trace where the electrically conductive layer on the second side is to be absent. Modify the layout according to the step of defining and manufacture the layered structure according to the modified layout.

Method of fabricating the routing of electrical signals

A stripline structure. The stripline structure includes a stripline transmission line, a first ground plane, a first dielectric layer overlaying the first ground plane, a conductive trace overlaying the first dielectric layer, a second dielectric layer overlaying the conductive trace, a second ground plane overlaying the second dielectric layer, multiple first conductive vias, and multiple second conductive vias. Each first conductive via and each second conductive via electrically connects the first ground plane to the second ground plane. The multiple first conductive vias are located along a first line parallel to the conductive trace, and the multiple second conductive vias are located along a second line parallel to the conductive trace. The first line and the second line are located on opposite sides of the conductive trace.

Stripline structure with multiple ground vias separated by no more than 100 mil

An apparatus for routing electrical signals is a layered structure having a signal trace connected to a via and to a conductive stub trace on a first side. A reference layer is on a second side of the layered structure. Removing a portion of the conductive reference layer in an area of the stub strace increases the impedance of the stub trace without changing the impedance of the signal trace thereby improving an impedance match to another electrical element to which the apparatus is connected.

Apparatus for routing electrical signals

A high-performance, integrated circuit interconnection laminate. Power/ground layers in laminates fabricated with open areas to permit out gassing of gases generated during high temperature lamination are located such that they do not lie under/over critical traces on signal layers. This placement of the open areas enables a reduction in cross-talk between signal layers lying on opposite sides of a power/ground layer and a reduction in signal delay.

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Fort Collins, CO, United States of America

William Scott Burton