Amp LLC

William S Scheingold

Frank C Youngfleish

Gabriel B Cherian

Edward John Bright

Steven J Kandybowski

Wilmer L Sheesley

John P Redmond

Richard L Marks

Richard Henry Zimmerman

Daniel Marshall Andrews

Ned E Corman

Joseph F Merlina

LaVern Dale Wulf

George Ulbrich

David A Kaplon

Ronald M Smith

Harold Lawrence Purdy

Glenn A Engle

An electrical connector for electrically interconnecting conductive pads on a printed circuit board and an electronic package located in an opening in the board and for biasing the electronic package against a cooling substructure on which it rests. More particularly, the connector includes a housing having downwardly extending walls for abutting and biasing the electronic package against the substructure and a plurality of contact elements having spring members which electrically engage respective conductive pads on the electronic package and surrounding circuit board.

Electrical connector

The present invention relates to an electrical connector for receiving two tab-type terminals which may be misaligned relative to the connector and to each other. More particularly, the connector includes one or more elongated, conductive contact units with each unit having tab terminal receiving receptacles at opposing ends and are mounted for both rotational and vertical movement so that the receptacles may receive misaligned tab terminals.

Electrical connector having movable contact units

The present invention relates to a connector for holding a ceramic substrate and for electrically connecting its circuits to a printed circuit board. More particularly, the connector includes a housing containing a plurality of cells, contact carrying spring members positioned in the cells and a cover which loads the substrate against spring members. The spring members have a pin for insertion into a printed circuit board and a preloaded upper section for substrate engagement.

Connector for a ceramic substrate

The present invention is to a heat sink device designed to conduct heat away from an active device substrate housed in a connector of the type having a hinged cover with spring elements thereon. More particularly the preferred embodiment includes a base member, in intimate contact with the substrate, positioned on the inside of the cover, and a heat exchanger attached to the base and extending above the cover.

Active device substrate connector having a heat sink

The present invention relates to a connector of the type for electrically connecting an active device substrate unit for a PCB (printed circuit board). More particularly, the invention includes a dual-contact spring member having a buffer section so that forces exerted on one contact are not transmitted to the other contact.

Active device substrate connector

The present invention relates to a connector for electrically connecting a substrate having a plurality of depending pins to a printed circuit board. More specifically, the invention disclosed is an insulating housing with a movable cover adapted to open normally closed contacts positioned in the housing so that the pins may be inserted.

The subject invention relates to a connector for electrically connecting a leadless electronic package to a printed circuit board. More particularly, the connector includes a frame-shape housing containing terminals having a circular contact section which engages the pads on the package. A clamp plate is also disclosed which secures the package and connector to the printed circuit board.

Connector for a leadless electronic package

The present invention relates to a connector for connecting a semi-conductor chip carrier to a printed circuit board (PCB). More particularly, the invention comprises an insulating housing and a plurality of contact-bearing spring members positioned around the periphery of a central compartment in the housing. The spring member connects the leads on the chip package to traces on the PCB.

Surface to surface connector

The present invention relates to an interconnect device to provide electrical connections between printed circuit boards or a supported flexible circuit board and a wire wrap connection or solder tail connection or the like. More specifically the preferred embodiment of the invention includes a device, stamped and formed from a coplanar strip of conductive material and having a double thickness leg on top of which is an elongated spring arm formed into a rectangular shape to reduce the height it occupies in a housing while providing high spring force. Additionally, stress-distribution means is incorporated into the device.

Electrical interconnect device

The present invention relates to a device for electrically interconnecting two printed circuit boards or the like where the conductive pads are on extremely close spacing. More particularly, the invention includes a plurality of resilient connectors embedded in an elastomeric material with opposing ends thereof being exposed on opposite surfaces of the elastomeric body to provide contact points.

Electrical interconnecting device

The present invention relates to a device for ejecting an electronic package from a connector. More particularly, the device includes a flat spring member adapted to be arched upwardly to push a electronic package out of engagement from the connector.

Ejection device for a electronic package connector

The present invention relates to a connecting element of the type for interconnecting electrical circuits on two electronic component-carrying devices such as printed circuit boards and substrate devices. More particularly the invention discloses a connecting element having a symmetrical, sinuous shape so as to provide a spring section for exerting a determined contact force. Further, the connecting element has, as an integral part thereof, a shorting beam to provide a shorter electrical path and to provide a spring means to hold the element in a housing.

Connecting element for surface to surface connectors

An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to ground potential, and which provides structural integrity.

Chip carrier

The present invention relates generally to a connector of the type for electrically connecting and mechanically retaining an integrated circuit package or other multi-pin devices to a printed circuit board. More particularly the connector contains a number of contact bearing, double arm spring members along either side. To insert a package the inside arms are pulled away from biasing contact with the outer arms by transversely moving two actuating members with a single centrally disposed longitudinally moving draw bar via cooperating ramp and slot configurations.

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Palmyra, PA, United States of America

William S Scheingold