Tyco Electronics Corporation

William Ring

Terry P Bowen

Randall Brian Wilson

Ching-Long Jiang

Richard Alan Anderson

John Baker Breedis

Mark S Soler

Tansen Varghese

A semiconductor laser device with a first side and a second side, comprising (a) an active region, (b) a P layer, wherein the P layer contains a first contact area, (c) an N layer, wherein said N layer contains a second contact area, wherein the contact area of the first contact area of the P layer and the second contact layer of the N layer reside on the first side of the laser device.

Flip-chip automatically aligned optical device

The present invention relates to a technique for fabricating a mechanical or visual alignment fiducial on a laser die particularly adapted for application with a laser die that is a buried structure edge emitting laser. In fabricating the device, the fiducial and the active mesa are formed in the same photolithography patterning step, using conventional techniques. The active is then buried with regrowth layers. The regrowth layers are subsequently selectively etched to expose the fiducial, leaving the active region protected and buried.

Method for fabricating fiducials for passive alignment of opto-electronic devices

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Ringoes, NJ, United States of America

William Ring