Google Inc.

Digital Equipment Corporation

Exaflop LLC

Hewlett-Packard Development Company, L.p.

Compaq Computer Corporation, Inc.

Other

William Riis Hamburgen

Jimmy Clidaras

Andrew B Carlson

John S Fitch

Donald L Beaty

William Howard Whitted

Gerald Aigner

Winnie Leung

Montgomery Sykora

Felix Jose Alvarez Rivera

James Tanner

Lawrence K Lam

Wolf-Dietrich Weber

Kevin Tom

Jonathan Beck

Xiaobo Fan

Ken Foo

David W Stiver

Benchiao Jai

Steven T Y Chow

John Nicholas Jitkoff

Glen Murphy

Amy A Han

Ken Krieger

Andrew Bowers

James Cooper

Ji Heun Lee

Kiarash Vakhshouri

Frank Hislop

Norman Paul Jouppi

Parthasarathy Ranganathan

Luiz Andre Barroso

Gregory P Imwalle

Yi Tao

Amir Meir Michael

Robert A Eustace

Robert Nelson Mayo

Selver Corhodzic

Robert Wasilewski

Yezdi Naval Dordi

Bruce M Schena

Jeffrey Y Hayashida

Ion Bita

Andreas Georg Nowatzyk

Sangmoo Choi

John Stuart Fitch

Daniel Henry Fourie

Keith E Moore

Aaron Leiba

Kelvin Kwong

Srikanth Lakshmikanthan

Taesung Kim

Brandon Baxter Harris

Joshua Boilard

Avi Hecht

Joshua Norman Lilje

Michael John Bliss

Alan W Lam

James Gettys

Ken Nicholas

Jonathan Nivet

Nai-Hsuan Liu

Sarah S M Cabreros

The present disclosure provides an electronic device utilizing a flexible display panel with multiple relief features formed in a periphery bending portion of the flexible display panel. The multiple relief features may facilitate lamination of the flexible display to a curved cover layer. The flexible display panel may have a circular shape utilized in a wearable device. An active area for displaying images may extend to the periphery bending portion of the flexible display panel, thus provided a wide viewing range for a user as well as enhancing an overall aesthetic appearance of the electronic device.

Flexible OLED display with reliefs

An apparatus includes a first layer including unidirectional first fibers oriented in a first direction and embedded within the first layer, where the first layer has a thickness of less than 25 μm and a second layer bound to the first layer, the second layer including unidirectional second fibers oriented in a second direction and embedded within the second layer, where the first layer has a thickness of less than 25 μm and where the first direction is nonparallel to the second direction.

Fiber-reinforced films

A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a spine member, where the spine member includes the memory and the processor, and a plurality of display pages, each display page coupled at a first edge of the page to the spine member and having a second edge, opposite the first edge that is free to rotate about an axis defined by the spine member, wherein at least one page includes two separately controllable OLED displays on opposite sides of the page.

Foldable display devices with multiple pages

A method of designing a data center can include determining a design power density, determining an oversubscription ratio, and determining a spatial layout of the data center using the design power density and the oversubscription ratio. The design power density can be in units of power per unit length.

Data center design

A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a foldable display layer configured for displaying information in response to the execution of the instructions, and a bend limit layer coupled to the foldable display layer and arranged substantially parallel to a display surface of the foldable display layer. The bend limit layer is configured to increase its stiffness non-linearly when a radius of a bend of the bend limit layer is less than a threshold radius of curvature of the foldable display layer, the threshold radius of curvature being greater than 1 mm and less than 20 mm.

Bend limit film

A method of providing cooled air to electronic equipment includes capturing heated air from a volume containing electronic equipment, cooling the heated air by more than fifteen degrees Celsius in an air-to-water heat exchanger, and supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air.

Warm water cooling

A system for providing cooled air to electronic equipment includes an evaporative cooling water source; a water-to-water heat exchanger in fluid communication with the evaporative water source; an air-to-water heat exchanger in fluid communication with the water-to-water heat exchanger and positioned to received heated air from a group of electronic devices; and a control system programmed to maintain a supply of cooling water to the air-to-water heat exchanger at a temperature above a dew point of air surrounding the air-to-water heat exchanger.

A foldable display of a computing device includes a back stiffening layer, a transparent frontplate layer, a transparent cover window layer, and an OLED display layer disposed between the back stiffening layer and the transparent frontplate layer. The OLED display layer characterized by a Young's modulus that is lower than the Young's modulus of the transparent frontplate layer and that is lower than the Young's modulus of the back stiffening layer; a neutral plane of the foldable display is located within the OLED display layer.

Foldable display neutral axis management with thin, high modulus layers

A computing device includes a case enclosure, a heat-generating electrical component, and a thermal insulator. The thermal insulator has a first surface adhesively bonded to the surface of the case enclosure and has a second surface adhesively bonded to the surface of the heat-generating component. The thermal insulator includes a layer of thermally-insulating material between the first and second surfaces, and the thermally-insulating material has a thermal conductivity less than 35 mW/m-K.

Thermally insulating adhesive

In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.

Variable thickness heat pipe

Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.

Vapor chamber with ring geometry

A computing device includes a keyboard without a key for a spacebar and a trackpad, where any portion of the trackpad is configurable to function as the spacebar and any portion of the trackpad is configurable to function as the trackpad.

Spacebar integrated with trackpad

Growing community of inventors

Los Altos, CA, United States of America

William Riis Hamburgen