Micron Technology Incorporated

Other

William R Stephenson

David R Hembree

Todd O Bolken

Bret K Street

Stephen F Moxham

Walter L Moden

Anthony D Veches

Semiconductor die assemblies having high efficiency thermal paths and molded underfill material. In one embodiment, a semiconductor die assembly comprises a first die and a plurality of second dies. The first die has a first functionality, a lateral region, and a stacking site. The second dies have a different functionality than the first die, and the second dies are in a die stack including a bottom second die mounted to the stacking site of the first die and a top second die defining a top surface of the die stack. A thermal transfer structure is attached to at least the lateral region of the first die and has a cavity in which the second dies are positioned. An underfill material is in the cavity between the second dies and the thermal transfer structure, and the underfill material covers the top surface of the die stack.

Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill

Semiconductor device packages include first and second semiconductor dice in a facing relationship. At least one group of solder bumps is substantially along a centerline between the semiconductor dice and operably coupled with integrated circuitry of the first and second semiconductor dice. Another group of solder bumps is laterally offset from the centerline and operably coupled only with integrated circuitry of the first semiconductor die. A further group of solder bumps is laterally offset from the centerline and operably coupled only with integrated circuitry of the second semiconductor die. Methods of forming semiconductor device packages include aligning first and second semiconductor dice with active surfaces facing each other, the first and second semiconductor dice each including bond pads along a centerline thereof and additional bond pads laterally offset from the centerline thereof.

Semiconductor devices and packages and methods of forming semiconductor device packages

Semiconductor devices and packages

A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus can further include a first connection structure carried by the support member. The first connection structure can have a first bond site configured to receive a flowable conductive material, and can further have at least two first elongated members connected and extending outwardly from the first bond site. Each first elongated member can be configured to receive at least a portion of the flowable conductive material from the first bond site, with none of the first elongated members being electrically coupled to the microelectronic substrate. The assembly can further include a second connection structure that is electrically coupled to the microelectronic substrate and that can include second elongated members extending away from a second bond site. The number of second elongated members can be equal to the number of first elongated members.

Methods for coupling a flowable conductive material to microelectronic substrates

Microelectronic assemblies and electronic devices including connection structures with multiple elongated members

A method and apparatus for encapsulating a BGA package. Specifically, a BGA package is encapsulated after the balls are attached to the package. The backside of the package having the balls disposed thereon may be completely covered by the encapsulant. The encapsulant is disposed in direct contact about a portion of the balls. A liner is provided to facilitate the formation of an unencapsulated portion of each ball. The unencapsulated portion may be used to couple the package to a system.

Methods of fabricating a molded ball grid array

058804113 A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus can further include a first connection structure carried by the support member. The first connection structure can have a first bond site configured to receive a flowable conductive material, and can further have at least two first elongated members connected and extending outwardly from the first bond site. Each first elongated member can be configured to receive at least a portion of the flowable conductive material from the first bond site, with none of the first elongated members being electrically coupled to the microelectronic substrate. The assembly can further include a second connection structure that is electrically coupled to the microelectronic substrate and that can include second elongated members extending away from a second bond site. The number of second elongated members can be equal to the number of first elongated members.

Apparatus for supporting microelectronic substrates

A method and apparatus for encapsulating a BGA package. Specifically, the molded packaging material is configured to provide cups on the backside of the package, opposite the semiconductor device. The cups expose pads on the substrate and are configured to receive solder balls.

Molded ball grid array

An adjustable threaded nock set (10) having a pair of serving nuts (11) and (12) having longitudinal bores therethrough. Each bore is threaded to engage monofilament serving (5) of bow string (4). Nuts (11) and (12) are installed onto serving (5) and tightened together at the proper location in a lock nut arrangement.

Adjustable threaded nock rest for archery

A diatomaceous earth caking filter element includes a first elongated tubular manifold having a slot therein and a suction coupling formed thereon for drawing a liquid from said first manifold. A second elongated tubular manifold has a slot therein and a plurality of hollow pipes connected between the first and second manifolds with one end of each pipe extending into the first manifold through the slot therein and the other end of each pipe extending into the second manifold through the slot therein. Each pipe is held by the slot edges of each manifold extending into an annular groove on each end of each pipe. A filter cake screen covers both sides of the plurality of hollow pipes for catching a filtering medium, such as diatomaceous earth, thereon for filtering liquid passing therethrough, so the liquid can be drawn through the filter medium and filter screen into the first and second manifolds and out the suction coupling. The liquid is drawn into both manifolds at both ends of the filter element to provide a more uniform flow of liquid through the filter cake and screen and to provide a more even distribution of the filter cake.

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Nampa, ID, United States of America

William R Stephenson