Hewlett-packard Development Company, L.p.

Hewlett-packard Company

William R Boucher

Chien-Hua Chen

Charles Craig Haluzak

Winthrop D Childers

Paul H McClelland

Scott A Lerner

James W Ring

Mark A Smith

Arthur Piehl

Ronald A Hellekson

Brett E Dahlgren

Joseph R Elliot

Marshall Field

John R Sterner

Michael G Groh

John M Altendorf

Gary J Watts

Peter R Stokes

Paul F Reboa

Gilbert G Smith

Charles L Thierheimer, Jr

Dale Dean Timm, Jr

David M Craig

William Scott Colburn

Frank L Cloutier

Joshua W Smith

Quan Qi

Christopher C Aschoff

Gary L Siewell

Todd A Berdahl

A micro-display has a device chip with a transparent layer overlying one or more micro-electromechanical system devices. A transparent cover overlies the transparent layer. An index-of-refraction-matching medium is interposed between the transparent layer and the transparent cover. An index of refraction of the index-of-refraction-matching medium is substantially equal to an index of refraction of the transparent layer and the transparent cover.

Micro-displays

A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.

Fluidic MEMS device

A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

Die carrier with fluid chamber

A mold configured to be coupled to a fluid ejection head die to allow a protective material to be molded around a plurality of contact pads on the die is disclosed. The mold includes a molding surface configured to cover the contact pads, wherein the molding surface is configured to support and shape the protective material during molding, and at least one side extending away from the molding surface, wherein the side is configured to contain the protective material during molding.

Fluid ejection device and method of manufacturing a fluid ejection device

An electronic device includes a substrate, a substrate electrical connector disposed on the substrate, and a carrier lead electrically coupled to the substrate electrical connector. In addition, the electronic device further includes a polymer enclosing the substrate electrical connector, and an inorganic film disposed over the substrate electrical connector in contact with the polymer.

Electronic devices having an inorganic film

In one embodiment of the invention, a flexible tape has formed on it conductors for being connected to a printhead substrate. The conductors on the tape are coated with an insulating layer, and exposed ends of the conductors extend from the layer. A headland is formed on a plastic print cartridge for receiving the printhead substrate having the exposed conductors extending from one or more edges of the printhead substrate. An adhesive bead is formed on the headland so that when the printhead is properly positioned on the headland, the adhesive contacts the conductors to encapsulate and insulate one exposed side of the conductors. A second adhesive or encapsulant bead is deposited over the opposite side of the conductors to encapsulate and insulate the remaining exposed regions of the conductors. In this manner, the combined insulating action of the insulating layer and the two insulating adhesive beads prevents the conductors from being shorted together by ink which may flow in the vicinity of the conductors.

Structure and method for preventing ink shorting of conductors connected

An orifice plate for an ink jet printhead wherein a plurality of elongated isolator slots are adjacent the orifices and in fluid communication therewith, so as to prevent cross-talk between adjacent orifices.

Ink jet printhead having hydraulically separated orifices

Growing community of inventors

Corvallis, OR, United States of America

William R Boucher