Allegro Microsystems, LLC

Other

Edward Weck & Co.

Corning Incorporated

Corning Intellisense Corporation

Jds Uniphase Corporation

Edward Weck Incorporated

Taylor, William

Weck & Company, Inc.

Peters, Rudolph

Peters, Ronald L.

William P Taylor

Michael C Doogue

Paul A David

Andreas P Friedrich

P Karl Scheller

Ravi Vig

Bryan Cadugan

Shaun D Milano

Harianto Wong

Vijay Mangtani

David Jamie Haas

Jonathan Jay Bernstein

Andrea Foletto

Rudolph W Peters

Alexander Latham

Devon Fernandez

Robert A Briano

Richard Dickinson

Georges El Bacha

Nirmal Sharma

Ronald L Peters

Gerardo A Monreal

Juan Manuel Cesaretti

Sundar Chetlur

Jeffrey Eagen

Jay J Gagnon

Ali Husain Yusuf Sirohiwala

Raymond W Engel

Katherine Shamberger

Maxim Klebanov

Eric G Shoemaker

Shixi Louis Liu

Eric Burdette

John B Sauber

Virgil Ararao

John Cummings

Michael J Gaboury

Mathew Drouin

Gary T Pepka

Jason Boudreau

Michael Morris

John David Brazzle

Gregory Delmain

Andrew S Huntington

Elsa Kam-Lum

Marie-Adelaide Lo

Samy Abdou

James K Lee

Craig S Petrie

Washington Lamar

Gregory A Kirkos

Ryan J Metivier

Christopher J Corcoran

John W Danforth

Cory Voisine

Michael G Ward

David Toebes

Carlos Horacio Mastrangelo

Chee-Kiong Ng

Harry Chandra

Sandra R Pinelle

Evan Shorman

Logan G Stewart

Kirsten Doogue

Edwin Thomas Carlen

William Boyd Alcorn

Marc Waelti

Diane Taylor

Leonardo T Magpantay

Raymond W Engle

Pota Taylor

Ronald Lee Peters

A sensor package comprising a lead frame, a current sensor die, and an interposer. The lead frame includes: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads. The current sensor die includes one or more sensing elements. The current sensor die is configured to measure a level of electrical current through the primary conductor of the lead frame. The interposer is disposed over the layer of dielectric material. The interposer includes a plurality of conductive traces that are configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads.

Leadless current sensor package with high isolation

Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Systems and methods for integrated shielding in a current sensor

Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, an isolator includes a leadframe having first and second die paddles each having opposed first and second surfaces, a first die supported by the first surface of the first die paddle, and a second die supported by the first surface of the second die paddle. The first and second die paddles are configured enhanced creepage characteristics.

Signal isolator having enhanced creepage characteristics

Methods and apparatus wavelength discrimination in a LiDAR system. An example embodiment, includes illuminating a field of view (FOV) with transmitted light having different wavelengths at different regions in the FOV, focusing incoming light with a lens of the LiDAR system, and diffracting the focused light from the lens with a diffraction optical element to generate signals having the different wavelengths to respective regions of a detector array, wherein each pixel position in the array corresponds to one of the different wavelengths and to a spatial location in the FOV. The data from the pixel array can be processed to discriminate any of the incoming light not transmitted by the LiDAR system.

LIDAR having wavelength discrimination

Methods and apparatus for detecting a magnetic field include a semiconductor substrate, a coil configured to provide a changing magnetic field in response to a changing current in the coil; and a magnetic field sensing element supported by the substrate. The coil receives the changing current and, in response, generates a changing magnetic field. The magnetic field sensing element detects the presence of a magnetic target by detecting changes to the magnetic field caused by the target and comparing them to an expected value.

Method and apparatus for magnetic sensor producing a changing magnetic field

Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, a signal isolator IC package comprises a leadframe including a die paddle having a first surface to support a die and an exposed second surface. A die is supported by a die paddle wherein a width of the second surface of the die paddle is less than a width of the die.

An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.

Integrated circuit package with magnet having a channel

A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.

Magnetic field sensor integrated circuit with integral ferromagnetic material

Methods and apparatus for a controlling a stimulus source to direct photons to a pixel in a pixel array contained in a detector system, analyzing a response of the pixel in the pixel array; and generating an alert based on the response of the pixel in the pixel array. Example stimulus sources include a conductive trace, a PN junction, and a current source.

Photonic ROIC having safety features

Methods and apparatus for receiving a return laser pulse at a detector system having pixels in a pixel array and analyzing a response of the pixels in the pixel array including comparing the response to at least one threshold corresponding to decay of photonic energy of the laser pulse over distance and target reflectivity, wherein the at least one threshold comprises a first threshold corresponding to a low trigger for a pulse generated by a first type of laser and a second threshold corresponding to a high trigger for the pulse generated by the first type of laser. Embodiments can further include generating an alert signal based on the response of the pixels in the pixel array.

Detector system having type of laser discrimination

Methods and apparatus for a magnetic sensor having a die and sensor circuitry formed in a device layer of the die with a coil integrated with the die to generate a magnetic field. A magnetoresistive magnetic field sensing element on the die detects changes in the magnetic field generated by the coil as a result of the presence of a ferromagnetic target. The sensor circuitry may process the changes in the magnetic field generated by the coil.

Methods and apparatus for magnetic sensor having integrated coil

A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.

Sensor integrated circuit with integrated coil and element in central region of mold material

A method includes forming a plurality of identical arrays on a semiconductor wafer, each array having a plurality of detectors, screening each of the plurality of arrays to determine an operational status of each of the plurality of arrays, and selecting one of the plurality of arrays for use based on the determination of the operational status of the plurality of arrays. Also described is a focal plane array including a circuit having a plurality of electrical contacts and a die including a plurality of identical arrays, each including a plurality of detectors. The plurality of identical arrays includes at least one selected array that is fully functional and at least one non-selected array that is not fully functional and the selected array is positioned with respect to the circuit so that the detectors of the selected array contact the plurality of electrical contacts of the circuit.

Detector array yield recovery

Detector system comparing pixel response with photonic energy decay

A magnetic field sensor includes a lead frame, a semiconductor die, a conductive coil, a mandrel, and a non-conductive mold material. The lead frame has a first surface, a second opposing surface, at least one slot, and a plurality of leads. The semiconductor die has a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame. The conductive coil is secured to the second surface of the lead frame and configured to operate as a back bias magnet to provide a magnetic field used to detect movement of a target. The coil is would around the mandrel and the mandrel is comprised of a ferromagnetic material. The non-conductive mold material encloses the die, the conductive coil, the mandrel, and at least a portion of the lead frame.

Magnetic field sensor integrated circuit with an integrated coil enclosed with a semiconductor die by a mold material

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Amherst, NH, United States of America

William P Taylor