Growing community of inventors

Albuquerque, NM, United States of America

William Mook

Average Co-Inventor Count = 9.26

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 8

William MookPaul Charles Galambos (1 patent)William MookBryan James Kaehr (1 patent)William MookKhalid Mikhiel Hattar (1 patent)William MookBrad Boyce (1 patent)William MookAndrew Jay Leenheer (1 patent)William MookMichael Shaw (1 patent)William MookSean J Hearne (1 patent)William MookKatherine L Jungjohann (1 patent)William MookNicholas Leathe (1 patent)William MookBradley Howell Jared (1 patent)William MookKatarina Adstedt (1 patent)William MookZachary Casias (1 patent)William MookBrian T Lester (1 patent)William MookErich Schwaller (1 patent)William MookNathan Heckman (1 patent)William MookClaire Chisholm (1 patent)William MookTodd Huber (1 patent)William MookWilliam Mook (2 patents)Paul Charles GalambosPaul Charles Galambos (40 patents)Bryan James KaehrBryan James Kaehr (20 patents)Khalid Mikhiel HattarKhalid Mikhiel Hattar (8 patents)Brad BoyceBrad Boyce (7 patents)Andrew Jay LeenheerAndrew Jay Leenheer (5 patents)Michael ShawMichael Shaw (4 patents)Sean J HearneSean J Hearne (4 patents)Katherine L JungjohannKatherine L Jungjohann (3 patents)Nicholas LeatheNicholas Leathe (2 patents)Bradley Howell JaredBradley Howell Jared (2 patents)Katarina AdstedtKatarina Adstedt (1 patent)Zachary CasiasZachary Casias (1 patent)Brian T LesterBrian T Lester (1 patent)Erich SchwallerErich Schwaller (1 patent)Nathan HeckmanNathan Heckman (1 patent)Claire ChisholmClaire Chisholm (1 patent)Todd HuberTodd Huber (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. National Technology & Engineering Solutions of Sandia, LLC (2 from 1,020 patents)


2 patents:

1. 10808794 - Topological damping materials and methods thereof

2. 10641733 - Active mechanical-environmental-thermal MEMS device for nanoscale characterization

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12/26/2025
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