Delco Electronics Corporation

William M Maki

Bruce Alan Myers

Ponnusamy Palanisamy

Dwight L Schwarz

John A Hearn

Timur Akin

Glen R Puterbaugh

A microaccelerometer package is provided for use in on-board automotive safety control and navigational systems. The microaccelerometer package is constructed so as to minimize the influence of extraneous mechanical stress and vibrational resonance on the micromachined accelerometer. The microaccelerometer package includes a rigid housing in which there is a cavity for receiving the micromachined accelerometer unit and the signal-processing circuitry. The lower surface of the cavity is interrupted by a recess projecting below the plane of the lower surface. The micromachined accelerometer unit is secured within the recess so as to be below the plane of the lower surface. The signal-processing circuitry is supported by a substrate which is secured to the lower surface of the cavity. One edge of the substrate, on which are disposed a number of wire bond sites, partially projects over the accelerometer unit within the recess, but no further than a corresponding number of wire bond sites on the micromachined accelerometer unit. Electrically interconnecting the wire bond sites of the signal-processing circuitry and the micromachined accelerometer unit are a corresponding number of electrical conductors.

Hybrid accelerometer assembly

An interface device for thermally coupling an integrated circuit to a heat sink having a first material characterized by high thermal conductivity such as copper, where the copper completely surrounds a plurality of inner core regions. The plurality of inner core regions contain a low coefficient of thermal expansion material and are primarily disposed in the copper material in the region directly under the integrated circuit. The low expansion regions retard thermal expansion of the interface device during exposure to variations in the temperature, yet there are continuous paths of copper provided between the integrated circuit and heat sink to promote efficient heat transfer between the silicon chip to the heat sink through the high conductivity copper. In addition, high thermal resistance layers are provided for dielectric isolation between an integrated circuit chip and heat sink, when necessary, using this invention. This interface device is characterized by enhanced thermal dissipation yet provides a compatible coefficient of thermal expansion with the silicon integrated circuit and underlying heat sink.

Interface device for thermally coupling an integrated circuit to a heat

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Fort Wayne, IN, United States of America

William M Maki