Vlsi Technology, Inc.

William M Loh

Sang S Lee

An apparatus and method for balancing the flow of molten molding compound above and below an integrated circuit assembly during encapsulation of the assembly. An annular shaped layer of material is placed over the bonding fingers of a leadframe such that the annular shaped layer of material peripherally surrounds the centrally located opening in the leadframe. The annular shaped layer of material has sufficient width and thickness to slow the flow of molten molding material over the top surface of the integrated circuit assembly to the same speed as the flow of molten material under the bottom surface of the integrated circuit package assembly. In so doing, the present invention reduces the formation of blowholes or voids in encapsulated integrated circuit packages.

Mold flow regulating dam ring

An encapsulated electrically and thermally enhanced integrated circuit is disclosed. An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate. A lead frame having inwardly-extending bonding fingers has the bottom sides thereof attached to the top of the substrate. A contiguous layer of insulating material is bonded to the top sides of the bonding fingers, such that the layer of insulating material peripherally surrounds the integrated-circuit die. A conductive layer of material is then bonded to the top of the insulating layer. A second layer of insulating material followed by a second conductive layer may be bonded on top of the first conductive layer. Electrical connections are made from the integrated-circuit die to the conductive layers surrounding the die. The device is then encapsulated in a plastic material.

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Fremont, CA, United States of America

William M Loh