Texas Instruments Corporation

William M Andreycak

Laszlo Balogh

Larry J Wofford

Christopher David Bridge

Robert Monroe

Chuck Payne

An AC-to-DC power converter that is capable of generating a regulated, isolated DC voltage output from a power factor corrected AC voltage input with improved efficiency. The AC-to-DC power converter is a two-stage power converter including a PFC stage connected in series to a power conversion stage. The PFC stage performs power factor correction using a zero current switching technique, and the power conversion stage includes a zero voltage switched half-bridge converter. The power conversion stage includes a transformer for providing the isolated DC voltage output. The AC-to-DC power converter includes a single feedback control loop for transferring error information from the DC voltage output to the PFC stage, thereby obtaining regulation of the DC voltage output.

Highly efficient isolated AC/DC power conversion technique

A power supply having a transformer-coupled power converter cascaded with a buck power converter. The transformer-coupled power converter operates in a free-running mode at a nearly 100% maximum duty cycle to convert an input voltage to an intermediate voltage. The buck power converter produces a regulated output voltage from the intermediate voltage. The power supply further includes a pulse width modulation (PWM) controller employing leading-edge modulation of complementary control signals used to control buck switches in the buck converter. The PWM controller is synchronized to primary-side free-running switches of the transformer-coupled power converter by a synchronization signal that is fed-forward across an isolation boundary via a signal transformer. The power supply also may also employ a soft-switching technique to reduce switching losses.

Unique power supply architecture with cascaded converters for large input-to-output step-down ratio

An electronic device includes a conductive member disposed within an insulative package. The conductive member is formed from a lead frame used to form the interconnection pins for the device. The conductive member includes an elongated, folded sense element portion having a known resistance. The sense element portion is disposed between two sets of conductive lead portions extending from the conductive member forming pins used to provide a current to the device for sensing. An integrated circuit disposed within the package includes a differential amplifier having differential inputs connected to bond pads on the integrated circuit. The bond pads are connected to spaced-apart tap points of the sense element via conductive bond wires, so that the combination of the sense element and the differential amplifier forms a trans-impedance amplifier. The gain of the differential amplifier is controlled to be proportional to the magnitude of a reference voltage generated by a bandgap voltage reference circuit. The reference voltage varies with temperature such that the overall gain of the trans-impedance amplifier is constant over temperature. The nominal gain of the differential amplifier is established by an on-chip resistance, which is trimmed using fuse-programmable trim cells that are programmed via operational package pins during a pre-operation trim procedure.

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Bedford, NH, United States of America

William M Andreycak