Amkor Technology, Inc.

Other

William M Anderson

Ahmer Raza Syed

Primitivo A Palasi

Harry J Fogelson

Ludovico Estrada Bancod

Sean Timothy Crowley

Terry W Davis

Bradley D Boland

Eelco Bergman

James M Anderson

Gregorio G Dela Cruz

Ludcvico Estrada Bancod

A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.

Lead frame with plated end leads

A lead frame strip for use in the manufacture of integrated circuit chip packages. The strip comprises at least one array defining a multiplicity of lead frames. The lead frames each include an outer frame defining a central opening having a die pad disposed therein. Attached to the outer frame and extending toward the die pad in spaced relation to each other are a plurality of leads. The outer frames are integrally connected to each other such that the lead frames are arranged in a matrix wherein the leads thereof extend in multiple rows and columns. The leads of the lead frames within each of the rows and columns are arranged in sets which are disposed in spaced relation to each other. A plurality of openings are formed within the strip between and in alignment with the leads of each of the lead frames within each of the rows and columns. The leads of each of the lead frames within each of the rows and columns and the openings collectively define saw streets for cutting the strip in a manner separating the lead frames from each other.

Reduced copper lead frame for saw-singulated chip package

A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces.

Power semiconductor package with strap

The Earthquake Motion Detector Alarm consists of a pendulum hanging within a sensor ring. At the instant of earth movement, the pendulum weight will make contact with the sensor ring setting off an audio alarm and floodlamp. The magnetized sensor ring can be adjusted so the detector can be installed to function on all vertical walls by positioning the pendulum weight within the ring.

Earthquake motion detector alarm

Growing community of inventors

Gilbert, AZ, United States of America

William M Anderson